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SNJ54LS10J-00

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14

器件类别:逻辑   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

敬请期待
器件参数
参数名称
属性值
厂商名称
Texas Instruments(德州仪器)
Reach Compliance Code
unknown
Is Samacsys
N
系列
LS
JESD-30 代码
R-GDIP-T14
长度
19.56 mm
负载电容(CL)
15 pF
逻辑集成电路类型
NAND GATE
功能数量
3
输入次数
3
端子数量
14
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
最大电源电流(ICC)
3.3 mA
传播延迟(tpd)
15 ns
认证状态
Not Qualified
座面最大高度
5.08 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
TTL
温度等级
MILITARY
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
7.62 mm
Base Number Matches
1
参数对比
与SNJ54LS10J-00相近的元器件有:SNJ54LS10W-10、SNJ54LS10W-00、M38510/30005BCX、M38510/30005B2X、M38510/30005SDX、M38510/30005BDX、M38510/30005SCX。描述及对比如下:
型号 SNJ54LS10J-00 SNJ54LS10W-10 SNJ54LS10W-00 M38510/30005BCX M38510/30005B2X M38510/30005SDX M38510/30005BDX M38510/30005SCX
描述 LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14 IC LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, Gate LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14 LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 LS SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 LS SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14 LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
厂商名称 Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
Reach Compliance Code unknown unknown unknown compliant compliant compliant compliant compliant
系列 LS LS LS LS LS LS LS LS
JESD-30 代码 R-GDIP-T14 R-GDFP-F14 R-GDFP-F14 R-GDIP-T14 S-CQCC-N20 R-GDFP-F14 R-GDFP-F14 R-GDIP-T14
逻辑集成电路类型 NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
功能数量 3 3 3 3 3 3 3 3
输入次数 3 3 3 3 3 3 3 3
端子数量 14 14 14 14 20 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DIP DFP DFP DIP QCCN DFP DFP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE FLATPACK FLATPACK IN-LINE CHIP CARRIER FLATPACK FLATPACK IN-LINE
传播延迟(tpd) 15 ns 15 ns 15 ns 24 ns 24 ns 24 ns 24 ns 24 ns
认证状态 Not Qualified Not Qualified Not Qualified Qualified Qualified Qualified Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES NO YES YES YES NO
技术 TTL TTL TTL TTL TTL TTL TTL TTL
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE FLAT FLAT THROUGH-HOLE NO LEAD FLAT FLAT THROUGH-HOLE
端子位置 DUAL DUAL DUAL DUAL QUAD DUAL DUAL DUAL
负载电容(CL) 15 pF 15 pF 15 pF 50 pF 50 pF 50 pF 50 pF -
最大电源电流(ICC) 3.3 mA 3.3 mA 3.3 mA 3.3 mA 3.3 mA 3.3 mA 3.3 mA -
零件包装代码 - - - DIP QLCC DFP DFP DIP
包装说明 - - - CERAMIC, DIP-14 QCCN, DFP, DFP, DIP,
针数 - - - 14 20 14 14 14
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