型号
- 型号
- 关键词
64-BIT, 80MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
下载文档| 型号 | ST6X86P90+HS | ST6X86P133+HS | ST6X86P120+HS | ST6X86P150+HS | ST6X86P166+HS |
|---|---|---|---|---|---|
| 描述 | 64-BIT, 80MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 | 64-BIT, 110MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 | 64-BIT, 100MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 | 64-BIT, 120MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 | 64-BIT, 133MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
| 零件包装代码 | PGA | PGA | PGA | PGA | PGA |
| 包装说明 | IPGA, | CERAMIC, PGA-296 | CERAMIC, PGA-296 | CERAMIC, PGA-296 | CERAMIC, PGA-296 |
| 针数 | 296 | 296 | 296 | 296 | 296 |
| Reach Compliance Code | unknow | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.A.2 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 |
| 位大小 | 64 | 64 | 64 | 64 | 64 |
| 边界扫描 | NO | NO | NO | NO | NO |
| 最大时钟频率 | 40 MHz | 55.55 MHz | 50 MHz | 59.98 MHz | 66.66 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 集成缓存 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-CPGA-P296 | S-CPGA-P296 | S-CPGA-P296 | S-CPGA-P296 | S-CPGA-P296 |
| 长度 | 49.595 mm | 49.595 mm | 49.595 mm | 49.595 mm | 49.595 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 端子数量 | 296 | 296 | 296 | 296 | 296 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | IPGA | IPGA | IPGA | IPGA | IPGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.7 mm | 4.7 mm | 4.7 mm | 4.7 mm | 4.7 mm |
| 速度 | 80 MHz | 110 MHz | 100 MHz | 120 MHz | 133 MHz |
| 最大供电电压 | 3.7 V | 3.7 V | 3.7 V | 3.7 V | 3.7 V |
| 最小供电电压 | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 49.595 mm | 49.595 mm | 49.595 mm | 49.595 mm | 49.595 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 封装等效代码 | - | SPGA296,37X37 | SPGA296,37X37 | SPGA296,37X37 | SPGA296,37X37 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最大压摆率 | - | 5800 mA | 5400 mA | 6100 mA | 6600 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |