型号
- 型号
- 关键词
512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
下载文档
| 型号 | ST95041M3TR | ST95041B1 | ST95041B3 | ST95041M1TR | ST95041M3 |
|---|---|---|---|---|---|
| 描述 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 512X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 512X8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 512X8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | SOIC | DIP | DIP | SOIC | SOIC |
| 包装说明 | SOP, | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 9.55 mm | 9.55 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C |
| 组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 5.9 mm | 5.9 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 是否无铅 | - | 含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 |
| 数据保留时间-最小值 | - | 40 | 40 | - | 40 |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
| JESD-609代码 | - | e0 | e0 | - | e0 |
| 封装等效代码 | - | DIP8,.3 | DIP8,.3 | - | SOP8,.25 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | - | 5 V |
| 最大待机电流 | - | 0.00005 A | 0.00005 A | - | 0.00005 A |
| 最大压摆率 | - | 0.002 mA | 0.002 mA | - | 0.002 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE |
模拟与混合信号
微控制器 MCU
嵌入式系统
ARM技术
嵌入式系统
模拟电子
