2. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
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2
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
1000
T
J
= 25°C
I
Z(AC)
= 0.1 I
Z(DC)
f = 1 kHz
1000
IF, FORWARD CURRENT (mA)
Z ZT , DYNAMIC IMPEDANCE (
Ω
)
100
100
I
Z
= 1 mA
10
5 mA
10
150°C
75°C
1.0
3.0
10
V
Z
, NOMINAL ZENER VOLTAGE
80
0.4
0.5
25°C
0°C
1.1
1.2
1.0
0.6
0.7
0.8
0.9
1.0
V
F
, FORWARD VOLTAGE (V)
Figure 1. Effect of Zener Voltage on Zener Impedance
Figure 2. Typical Forward Voltage
1000
T
A
= 25°C
C, CAPACITANCE (pF)
0 V BIAS
1 V BIAS
IR, LEAKAGE CURRENT (
μ
A)
1000
100
10
1.0
0.1
0.01
+ 25°C
−55°C
0
10
20
30
40
50
60
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
+150°C
100
10
BIAS AT
50% OF V
Z
NOM
0.001
0.0001
1.0
4.0
10
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
0.00001
Figure 3. Typical Capacitance
Figure 4. Typical Leakage Current
100
T
A
= 25°C
I Z , ZENER CURRENT (mA)
100
IZ , ZENER CURRENT (mA)
T
A
= 25°C
10
10
1.0
1
0.1
0.1
0.01
0.01
0
2.0
4.0
6.0
8.0
V
Z
, ZENER VOLTAGE (V)
10
12
10
30
50
70
V
Z
, ZENER VOLTAGE (V)
90
Figure 5. Zener Voltage versus Zener Current
(V
Z
Up to 12 V)
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
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3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
100
80
POWER DISSIPATION (%)
60
40
20
0
0
25
50
75
100
TEMPERATURE (°C)
125
150
Figure 7. Steady State Power Derating
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4
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
STYLE 1:
PIN 1. CATHODE
2. ANODE
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
H
E
D
b
1
2
E
MIN
0.031
0.000
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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