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TD62002AFG

toshiba bipolar digital integrated circuit silicon monolithic

器件类别:分立半导体    晶体管   

厂商名称:Toshiba(东芝)

厂商官网:http://toshiba-semicon-storage.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Toshiba(东芝)
零件包装代码
SOIC
包装说明
SMALL OUTLINE, R-PDSO-G16
针数
16
Reach Compliance Code
unknow
ECCN代码
EAR99
其他特性
LOGIC LEVEL COMPATIBLE
最大集电极电流 (IC)
0.5 A
集电极-发射极最大电压
50 V
配置
COMPLEX
最小直流电流增益 (hFE)
1000
JESD-30 代码
R-PDSO-G16
元件数量
7
端子数量
16
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
NPN
认证状态
Not Qualified
表面贴装
YES
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
TD62001~004APG/AFG
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62001APG,TD62001AFG,TD62002APG,TD62002AFG,
TD62003APG,TD62003AFG,TD62004APG,TD62004AFG
7-channel Darlington Sink Driver
The TD62001APG/AFG Series are high-voltage, high-current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
Features
l
l
l
l
l
Output current (single output): 500 mA (max)
High sustaining voltage output: 50 V (min)
Output clamp diodes
Inputs compatible with various types of logic
Package type
APG: DIP-16 pin (Pb free package)
AFG: SOP-16 pin (Pb free package)
Type
TD62001APG/AFG
TD62002APG/AFG
TD62003APG/AFG
TD62004APG/AFG
Input base resistor
External
10.5-kΩ + 7-V
Zenner diode
2.7 kΩ
10.5 kΩ
Designation
General purpose
14-V to 25-V PMOS
TTL, 5-V CMOS
6-V to 15-V PMOS,
CMOS
Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)
Pin Connection
(top view)
1
2002-12-11
TD62001~004APG/AFG
Schematics
(each driver)
TD62001APG/AFG
TD62002APG/AFG
TD62003PAPG/AFG
TD62004APG/AFG
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
Maximum Ratings
(Ta = 25°C)
Characteristics
Output sustaining voltage
Output current
Input voltage
Input current
Clamp diode reverse voltage
Clamp diode forward current
APG
Power dissipation
Operating temperature
Storage temperature
AFG
P
D
T
opr
T
stg
Symbol
V
CE (SUS)
I
OUT
V
IN
(Note 1)
I
IN
(Note 2)
V
R
I
F
Rating
-0.5
to 50
500
-0.5
to 30
25
50
500
1.47
0.625
(Note 3)
-40
to 85
-55
to 150
W
°C
°C
Unit
V
mA/ch
V
mA
V
mA
Note 1: Except TD62001APG/AFG
Note 2: Only TD62001APG/AFG
Note 3: When mounted on a glass-epoxy PCB (30 mm
´
30 mm
´
1.6 mm, Cu area: 50%)
2
2002-12-11
TD62001~004APG/AFG
Recommended Operating Conditions
(Ta =
−40°C
to 85°C)
Characteristics
Output sustaining voltage
APG
Output current
AFG
Except
TD62001APG/
AFG
TD62002
Input voltage (output on)
TD62003
TD62004
TD62001
Input voltage (output off)
TD62002
TD62003
TD62004
Input current
Only TD62001
I
IN
V
R
I
F
APG
AFG
P
D
Ta = 85°C
Ta = 85°C
(Note)
V
IN (OFF)
V
IN (ON)
I
OUT
= 400 mA
h
FE
= 800
I
OUT
Symbol
V
CE (SUS)
Duty = 10%
T
pw
= 25 ms
7 circuits
Ta = 85°C
T
j
= 120°C
Duty = 50%
Duty = 10%
Duty = 50%
V
IN
Condition
Min
0
0
0
0
0
0
14.5
2.8
6.2
0
0
0
0
0
Typ.
Max
50
370
130
233
70
24
24
24
24
0.6
7.4
0.7
1.0
10
50
350
0.76
0.325
mA
V
mA
W
V
V
V
mA/ch
Unit
V
Input voltage
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
Note: When mounted on a glass-epoxy PCB (30 mm
´
30 mm
´
1.6 mm, Cu area: 50%)
3
2002-12-11
TD62001~004APG/AFG
Electrical Characteristics
(Ta = 25°C unless otherwise noted)
Characteristics
Ooutput leakage current
Symbol
I
CEX
Test
Circuit
1
Test Condition
V
CE
= 50 V, Ta = 25°C
V
CE
= 50 V, Ta = 85°C
I
OUT
= 350 mA, I
IN
= 500
mA
Collector−emitter saturation voltage
V
CE (sat)
2
I
OUT
= 200 mA, I
IN
= 350
mA
I
OUT
= 100 mA, I
IN
= 250
mA
DC current transfer ratio
TD62002
Input current (output on)
TD62003
TD62004
Input current (output off)
TD62002
V
CE
= 2 V
h
FE
= 800
I
IN (OFF)
4
I
IN (ON)
3
h
FE
2
V
CE
= 2 V, I
OUT
= 350 mA
V
IN
= 20 V, I
OUT
= 350 mA
V
IN
= 2.4 V, I
OUT
= 350 mA
V
IN
= 9.5 V, I
OUT
= 350 mA
I
OUT
= 500
mA,
Ta = 85°C
I
OUT
= 350 mA
I
OUT
= 200 mA
V
IN (ON)
5
I
OUT
= 350 mA
I
OUT
= 200 mA
I
OUT
= 350 mA
I
OUT
= 200 mA
I
R
V
F
C
IN
t
ON
t
OFF
6
7
8
8
V
OUT
= 50 V, R
L
= 125
W
C
L
= 15 pF
V
OUT
= 50 V, R
L
= 125
W
C
L
= 15 pF
V
R
= 50 V, Ta = 25°C
V
R
= 50 V, Ta = 85°C
I
F
= 350 mA
Min
1000
50
Typ.
1.3
1.1
0.9
1.1
0.4
0.8
65
15
0.1
0.2
Max
50
100
1.6
1.3
1.1
1.7
0.7
1.2
13.7
11.4
2.6
2.0
4.7
4.4
50
100
2.0
ms
mA
V
pF
V
mA
mA
V
Unit
mA
Input voltage (output on)
TD62003
TD62004
Clamp diode reverse current
Clamp diode forward voltage
Input capacitance
Turn−on delay
Turn−off delay
4
2002-12-11
TD62001~004APG/AFG
Test Circuit
1.
I
CEX
2.
V
CE (sat)
, h
FE
3.
IIN (ON)
4.
I
IN (OFF)
5.
V
IN (ON)
6.
I
R
7.
V
F
5
2002-12-11
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参数对比
与TD62002AFG相近的元器件有:TD62001AFG、TD62001APG、TD62004AFG、TD62004APG。描述及对比如下:
型号 TD62002AFG TD62001AFG TD62001APG TD62004AFG TD62004APG
描述 toshiba bipolar digital integrated circuit silicon monolithic toshiba bipolar digital integrated circuit silicon monolithic toshiba bipolar digital integrated circuit silicon monolithic toshiba bipolar digital integrated circuit silicon monolithic toshiba bipolar digital integrated circuit silicon monolithic
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合
零件包装代码 SOIC SOIC DIP SOIC DIP
包装说明 SMALL OUTLINE, R-PDSO-G16 0.225 INCH, LEAD FREE, PLASTIC, SOP-16 LEAD FREE, DIP-16 0.225 INCH, LEAD FREE, PLASTIC, SOP-16 IN-LINE, R-PDIP-T16
针数 16 16 16 16 16
Reach Compliance Code unknow unknow unknow unknown unknown
配置 COMPLEX COMPLEX COMPLEX COMPLEX COMPLEX
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDIP-T16
元件数量 7 7 7 7 7
端子数量 16 16 16 16 16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES NO YES NO
端子形式 GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON
ECCN代码 EAR99 EAR99 - EAR99 EAR99
其他特性 LOGIC LEVEL COMPATIBLE LOGIC LEVEL COMPATIBLE - LOGIC LEVEL COMPATIBLE BUILT-IN BIAS RESISTOR, LOGIC LEVEL COMPATIBLE
最大集电极电流 (IC) 0.5 A 0.5 A - 0.5 A 0.5 A
集电极-发射极最大电压 50 V 50 V - 50 V 50 V
最小直流电流增益 (hFE) 1000 1000 - 1000 1000
极性/信道类型 NPN NPN - NPN NPN
Base Number Matches - 1 1 1 -
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