TGL2205
S and C-Band 100 W VPIN Limiter
Applications
•
Receive Chain Protection
•
Commercial and Military Radar
Product Features
•
•
•
•
•
•
•
•
Frequency Range: 1 to 6 GHz
Insertion Loss: < 0.5 dB
Peak Power Handling: 100W (pulsed)
Flat Leakage:
≤
16 dBm
Return Loss: 12 dB
Passive (no DC bias required)
Integrated DC Block on output
Chip Dimensions: 2.0 x 2.0 x 0.1 mm
Functional Block Diagram
1
RF In
2
RF Out
General Description
The TriQuint TGL2205 is a high power, wideband MMIC
GaAs VPIN limiter capable of protecting sensitive
receive channel components against high power incident
signals. The TGL2205 does not require DC bias and
achieves a low insertion loss all in a small form factor.
These features allow for simple integration with minimal
impact to system performance.
The TGL2205 operates from 1 to 6 GHz and achieves
low insertion loss of 0.5 dB and return loss of 12 dB. It
can limit up to 100 W incident pulsed-power with a low
flat leakage of 16 dBm.
The TGL2205 has a protective surface passivation layer
providing environmental robustness and is ideally suited
to support both commercial and defense related
applications.
Lead-free and RoHS compliant.
Pad Configuration
Pad No.
1
2
Symbol
RF In
RF Out
Ordering Information
Part
TGL2205
ECCN
EAR99
Description
S and C-Band 100W
VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
© 2013 TriQuint
- 1 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
TGL2205
S and C-Band 100 W VPIN Limiter
Absolute Maximum Ratings
Parameter
Incident Power, CW or Pulsed, 50Ω, 25C
Incident Power, CW or Pulsed, 50Ω, 85C
Mounting Temperature
(30 Seconds)
Storage Temperature
Recommended Operating Conditions
Value
100W
50W
320C
−40 to
150C
Parameter
Passive – No bias
Value
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Operation of this device outside the parameter ranges
given above may cause permanent damage. These are
stress ratings only, and functional operation of the device at
these conditions is not implied.
Electrical Specifications
Test conditions unless otherwise noted: T = 25°
C
Parameter
Operational Frequency Range
Insertion Loss
Input Return Loss
Output Return Loss
Flat Leakage Power at P
IN
> 30 dBm
Insertion Loss Temperature Coefficient
Conditions
Min
1
Typ
< 0.5
12
12
≤
16
0.003
Max
6
Units
GHz
dB
dB
dB
dBm
dB/°C
Thermal and Reliability Information
Parameter
Incident Power
(1)
(RF Operational Life Test 168 Hours )
Test Conditions
Frequency = 4.5 GHz, CW, 50Ω, 25C
Frequency = 4.5 GHz, Pulsed, PW=10us, DC=10%,
50Ω, 25C
Value
31
100
Units
W
W
Notes:
1. Test was terminated at 168 hours. Insertion Loss remained
≤
1 dB for device under test.
Preliminary Datasheet: Rev - 09-21-13
© 2013 TriQuint
- 2 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
TGL2205
S and C-Band 100 W VPIN Limiter
Typical Performance
S-Parameters vs. Frequency
0.0
+25C
IL
IRL
ORL
Insertion Loss vs. Frequency vs. Temp
0
Insertion Loss (dB)
0.0
Temp varies
Insertion Loss (dB)
Return Loss (dB)
0.2
0.4
0.6
0.8
1.0
1.2
1
2
3
4
5
Frequency (GHz)
6
5
10
15
20
25
30
7
0.2
0.4
0.6
0.8
1.0
1.2
1
2
3
4
5
Frequency (GHz)
6
7
-40C
+25C
+85C
Output Power vs. Pin vs. Frequency
17.0
16.5
Pout (dBm)
CW, +25
0
C
Output Power vs. Pin vs. Frequency
17.0
16.5
16.0
15.5
15.0
14.5
14.0
4.0 GHz
4.5 GHz
5.5 GHz
6.0 GHz
7.0 GHz
Pulse: PW = 10 us, DC = 10%, +25
0
C
Pout (dBm)
16.0
15.5
15.0
14.5
14.0
30
32
34
36
1.0 GHz
2.1 GHz
3.0 GHz
3.5 GHz
3.7 GHz
38 40 42
Pin (dBm)
44
46
48
50
30
32
34
36
38 40 42
Pin (dBm)
44
46
48
50
Output Power vs. Pin vs. Frequency
17.0
16.5
Pout (dBm)
CW, -40
0
C
Output Power vs. Pin vs. Frequency
17.0
16.5
CW, +85
0
C
16.0
15.5
15.0
14.5
14.0
30
32
34
36
38 40 42
Pin (dBm)
44
46
48
50
3.0 GHz
3.5 GHz
3.7 GHz
Pout (dBm)
16.0
15.5
15.0
3.0 GHz
14.5
14.0
30
32
3.5 GHz
3.7 GHz
34
36
38 40 42
Pin (dBm)
44
46
48
50
Preliminary Datasheet: Rev - 09-21-13
© 2013 TriQuint
- 3 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
TGL2205
S and C-Band 100 W VPIN Limiter
Assembly Drawing
Mechanical Information and Pad Description
2
1
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: ± 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Pad Number
1
2
Symbol
RF In
RF Out
Description
Input; matched to 50
Ω.
Output; matched to 50
Ω.
- 4 of 6 -
Pad Size
0.100 x 0.200
0.100 x 0.150
Disclaimer: Subject to change without notice
Preliminary Datasheet: Rev - 09-21-13
© 2013 TriQuint
www.triquint.com
TGL2205
S and C-Band 100 W VPIN Limiter
Assembly Notes
Component placement and adhesive attachment assembly notes:
•
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
•
Air bridges must be avoided during placement.
•
The force impact is critical during auto placement.
•
Solder or Organic Adhesive attachment can be used for TGL2205.
•
Curing should be done in a convection oven; proper exhaust is a safety concern.
Solder attachment reflow process assembly notes:
•
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3 to 4 minutes, maximum.
•
An alloy station or conveyor furnace with reducing atmosphere should be used.
•
Do not use any kind of flux.
•
Coefficient of thermal expansion matching is critical for long-term reliability.
•
Devices must be stored in a dry nitrogen atmosphere.
Organic adhesive attachment assembly notes:
•
The organics such as epoxy or polyimide can be used.
•
Epoxies cure at temperatures of 100 to 200°
C.
Interconnect process assembly notes:
•
Thermosonic ball bonding is the preferred interconnect technique.
•
Force, time, and ultrasonics are critical parameters.
•
Aluminum wire should not be used.
•
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Datasheet: Rev - 09-21-13
© 2013 TriQuint
- 5 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
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