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TIM5964-60SL-251

TRANSISTOR C BAND, Si, N-CHANNEL, RF POWER, JFET, 2-16G1B, 2 PIN, FET RF Power

器件类别:分立半导体    晶体管   

厂商名称:Toshiba(东芝)

厂商官网:http://toshiba-semicon-storage.com/

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器件参数
参数名称
属性值
厂商名称
Toshiba(东芝)
包装说明
FLANGE MOUNT, R-CDFM-F2
针数
2
Reach Compliance Code
unknown
ECCN代码
EAR99
外壳连接
SOURCE
配置
SINGLE
最小漏源击穿电压
15 V
最大漏极电流 (Abs) (ID)
31 A
FET 技术
JUNCTION
最高频带
C BAND
JESD-30 代码
R-CDFM-F2
元件数量
1
端子数量
2
工作模式
DEPLETION MODE
最高工作温度
175 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
极性/信道类型
N-CHANNEL
功耗环境最大值
125 W
认证状态
Not Qualified
表面贴装
YES
端子形式
FLAT
端子位置
DUAL
晶体管元件材料
SILICON
文档预览
PRELIMINARY
March 2001
TIM5964-60SL-251
1. RF PERFORMANCE SPECIFICATIONS
CHARACTERISTICS
Output Power at 1dB
Compression Point
Power Gain at 1dB
Compression Point
Drain Current
Power Added Efficiency
3rd Order Intermodulation
Distortion
NOTE :
Two Tone Test,
Po= 36.5dBm
(Single Carrier Level)
Recommended Gate Resistance(Rg) : 28
(Max.)
( Ta= 25
°
C )
MIN. TYP. MAX. UNIT
47.0 48.0
dBm
dB
A
%
dBc
SYMBOL
P
1dB
CONDITION
V
DS
= 10V
G
1dB
I
DS
f= 5.9–6.75GHz
IDS set = 9.5A
7.5
8.5
13.2 15.0
41
η
add
IM
3
NOTE
-40
2. ELECTRICAL CHARACTERISTICS
CHARACTERISTICS
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
Channel-Temperature
Rise
SYMBOL
g
m
V
GSoff
I
DSS
V
GSO
( Ta= 25
°
C )
MIN. TYP. MAX. UNIT
-1.0
-5
20
-1.8
24
0.6
-3.0
31
S
V
A
V
CONDITION
V
DS
= 3V
I
DS
= 12A
V
DS
= 3V
I
DS
= 200mA
V
DS
= 3V
V
GS
= 0V
I
GS
= -1.0mA
R
th(c-c)
Channel to Case
∆T
ch
V
DS
×I
DS
×R
th(c-c)
0.8
°C/W
90
°C
The specifications contained herein are subject to change without notice.
PRELIMINARY
March 2001
3. ABSOLUTE MAXIMUM RATINGS
CHARACTERISTICS
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Total Power Dissipation (Tc= 25
°
C)
Channel Temperature
Storage Temperature
( Ta= 25°C )
SYMBOL
VDS
VGS
IDS
PT
Tch
Tstg
RATING
15
-5
31
125
175
-65
+175
UNIT
V
V
A
W
°
C
°
C
PACKAGE OUTLINE (2-16G1B)
0.7
±
0.15
4 – C1.0
2.5 MIN.
Unit in mm
: Gate
: Source
17.4
±
0.4
8.0
±
0.2
: Drain
20.4
±
0.3
+0.1
0.1 -
0.05
24.5 MAX.
16.4 MAX.
2.5 MIN.
0.2 MAX.
1.4
±
0.3
2.4
±
0.3
5.5 MAX.
Applications Engineering
Solid-State Engineering Department
TOSHIBA CORPORATION, Komukai Operations
2.6
±
0.3
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