型号
- 型号
- 关键词
| 型号 | TLC193MJGB | TLC393QDRG4 | TLC393IPWG4 | TLC393CPSG4 | 5962-9555101NXDR | 5962-9555101QPA | TLC193 | TLC393 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125 | Dual, Micropower, LinCMOS™ Voltage Comparator 8-SOIC | Dual, Micropower, LinCMOS™ Voltage Comparator 8-TSSOP -40 to 85 | Analog Comparators Dual,Micropower,Lin CMOS Vltg Comparator | Dual Micropower LinCMOS™ Comparator 8-SOIC | Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125 | TLC193 Dual Micropower LinCMOS™ Comparator | TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | DIP | SOIC | SOIC | - | SOIC | DIP | - | - |
| 包装说明 | DIP, DIP8,.3 | SOIC-8 | TSSOP, TSSOP8,.25 | - | SOP, | DIP, DIP8,.3 | - | - |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | - | - |
| Reach Compliance Code | not_compliant | compliant | compliant | - | compliant | not_compliant | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | - | - |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | - | 6 weeks | 6 weeks | - | - |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | - | COMPARATOR | COMPARATOR | - | - |
| 最大平均偏置电流 (IIB) | 0.03 µA | 0.000002 µA | 0.002 µA | - | 0.00003 µA | 0.00003 µA | - | - |
| 最大输入失调电压 | 10000 µV | 10000 µV | 7000 µV | - | 10000 µV | 10000 µV | - | - |
| JESD-30 代码 | R-GDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-GDIP-T8 | - | - |
| 长度 | 9.58 mm | 4.9 mm | 4.4 mm | - | 4.9 mm | 9.58 mm | - | - |
| 功能数量 | 2 | 2 | 2 | - | 2 | 2 | - | - |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | - | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | - | -55 °C | -55 °C | - | - |
| 输出类型 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | - | OPEN-DRAIN | OPEN-DRAIN | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | SOP | TSSOP | - | SOP | DIP | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | - | 260 | NOT SPECIFIED | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Qualified | - | - |
| 标称响应时间 | 2500 ns | 2500 ns | 2500 ns | - | 2500 ns | 2500 ns | - | - |
| 座面最大高度 | 5.08 mm | 1.75 mm | 1.2 mm | - | 1.75 mm | 5.08 mm | - | - |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | - | 0.04 mA | 0.02 mA | - | - |
| 供电电压上限 | 18 V | 18 V | 18 V | - | 18 V | 18 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | YES | - | YES | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | - | - |
| 温度等级 | MILITARY | AUTOMOTIVE | INDUSTRIAL | - | MILITARY | MILITARY | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | - | GULL WING | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 0.65 mm | - | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 7.62 mm | 3.9 mm | 3 mm | - | 3.9 mm | 7.62 mm | - | - |
电源技术
分立器件
工控电子
嵌入式系统
模拟电子
无线连接