TLV321AC36IPT,TLV321AC36IPT pdf中文资料,TLV321AC36IPT引脚图,TLV321AC36IPT电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

Brand Name

Texas Instruments

是否无铅

含铅

厂商名称

Texas Instruments(德州仪器)

零件包装代码

QFP

包装说明

LFQFP,

针数

Reach Compliance Code

unknown

JESD-30 代码

S-PQFP-G48

长度

7 mm

功能数量

端子数量

最高工作温度

85 °C

最低工作温度

-40 °C

封装主体材料

PLASTIC/EPOXY

封装代码

LFQFP

封装形状

SQUARE

封装形式

FLATPACK, LOW PROFILE, FINE PITCH

认证状态

Not Qualified

座面最大高度

1.6 mm

标称供电电压

3 V

表面贴装

YES

技术

CMOS

电信集成电路类型

BASEBAND CIRCUIT

温度等级

INDUSTRIAL

端子形式

GULL WING

端子节距

0.5 mm

端子位置

QUAD

宽度

7 mm

参数对比

与TLV321AC36IPT相近的元器件有：TLV321AC37CDW、TLV321AC37CN、TLV321AC37IDW、TLV321AC37IPT、TLV321AC36CDW、TLV321AC36IDW、TLV321AC36CPT、TLV321AC36CN。描述及对比如下：

型号	TLV321AC36IPT	TLV321AC37CDW	TLV321AC37CN	TLV321AC37IDW	TLV321AC37IPT	TLV321AC36CDW	TLV321AC36IDW	TLV321AC36CPT	TLV321AC36CN
描述	3-V Voice-Band Audio Processors (VBAP) 48-LQFP	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48	IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20, Cellular Telephone Circuit	IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20, Cellular Telephone Circuit	IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48, Cellular Telephone Circuit	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	QFP	SOIC	DIP	SOIC	QFP	SOIC	SOIC	QFP	DIP
包装说明	LFQFP,	SOP,	DIP,	SOP,	LFQFP,	SOP,	SOP,	LFQFP,	DIP,
针数	48	20	20	20	48	20	20	48	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 代码	S-PQFP-G48	R-PDSO-G20	R-PDIP-T20	R-PDSO-G20	S-PQFP-G48	R-PDSO-G20	R-PDSO-G20	S-PQFP-G48	R-PDIP-T20
长度	7 mm	12.8 mm	24.325 mm	12.8 mm	7 mm	12.8 mm	12.8 mm	7 mm	24.325 mm
功能数量	1	1	1	1	1	1	1	1	1
端子数量	48	20	20	20	48	20	20	48	20
最高工作温度	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	70 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	SOP	DIP	SOP	LFQFP	SOP	SOP	LFQFP	DIP
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	FLATPACK, LOW PROFILE, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE	FLATPACK, LOW PROFILE, FINE PITCH	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	2.65 mm	5.08 mm	2.65 mm	1.6 mm	2.65 mm	2.65 mm	1.6 mm	5.08 mm
标称供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	NO	YES	YES	YES	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
电信集成电路类型	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT
温度等级	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
端子节距	0.5 mm	1.27 mm	2.54 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm	2.54 mm
端子位置	QUAD	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
宽度	7 mm	7.5 mm	7.62 mm	7.5 mm	7 mm	7.5 mm	7.5 mm	7 mm	7.62 mm