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TLV321AC37IDW

TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20

器件类别:无线/射频/通信    电信电路   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

敬请期待
器件参数
参数名称
属性值
厂商名称
Texas Instruments(德州仪器)
零件包装代码
SOIC
包装说明
SOP,
针数
20
Reach Compliance Code
unknown
JESD-30 代码
R-PDSO-G20
长度
12.8 mm
功能数量
1
端子数量
20
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
认证状态
Not Qualified
座面最大高度
2.65 mm
标称供电电压
3 V
表面贴装
YES
技术
CMOS
电信集成电路类型
BASEBAND CIRCUIT
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
宽度
7.5 mm
参数对比
与TLV321AC37IDW相近的元器件有:TLV321AC37CDW、TLV321AC37CN、TLV321AC37IPT、TLV321AC36CDW、TLV321AC36IPT、TLV321AC36IDW、TLV321AC36CPT、TLV321AC36CN。描述及对比如下:
型号 TLV321AC37IDW TLV321AC37CDW TLV321AC37CN TLV321AC37IPT TLV321AC36CDW TLV321AC36IPT TLV321AC36IDW TLV321AC36CPT TLV321AC36CN
描述 TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20 TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20 TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20 TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48 IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20, Cellular Telephone Circuit 3-V Voice-Band Audio Processors (VBAP) 48-LQFP IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SO-20, Cellular Telephone Circuit IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48, Cellular Telephone Circuit TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20
厂商名称 Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
零件包装代码 SOIC SOIC DIP QFP SOIC QFP SOIC QFP DIP
包装说明 SOP, SOP, DIP, LFQFP, SOP, LFQFP, SOP, LFQFP, DIP,
针数 20 20 20 48 20 48 20 48 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDIP-T20 S-PQFP-G48 R-PDSO-G20 S-PQFP-G48 R-PDSO-G20 S-PQFP-G48 R-PDIP-T20
长度 12.8 mm 12.8 mm 24.325 mm 7 mm 12.8 mm 7 mm 12.8 mm 7 mm 24.325 mm
功能数量 1 1 1 1 1 1 1 1 1
端子数量 20 20 20 48 20 48 20 48 20
最高工作温度 85 °C 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP DIP LFQFP SOP LFQFP SOP LFQFP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE IN-LINE FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE FLATPACK, LOW PROFILE, FINE PITCH IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 2.65 mm 5.08 mm 1.6 mm 2.65 mm 1.6 mm 2.65 mm 1.6 mm 5.08 mm
标称供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES NO YES YES YES YES YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
电信集成电路类型 BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT BASEBAND CIRCUIT
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 2.54 mm 0.5 mm 1.27 mm 0.5 mm 1.27 mm 0.5 mm 2.54 mm
端子位置 DUAL DUAL DUAL QUAD DUAL QUAD DUAL QUAD DUAL
宽度 7.5 mm 7.5 mm 7.62 mm 7 mm 7.5 mm 7 mm 7.5 mm 7 mm 7.62 mm
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