型号 | TM4164FM8-12L | TM4164FL8-12L | TM4164FL8-20L | TM4164FL8-15L | TM4164FM8-15L | TM4164FM8-20L |
---|---|---|---|---|---|---|
描述 | 64KX8 MULTI DEVICE DRAM MODULE, 120ns, SMA30, 3.500 X 0.600 INCH, SIMM-30 | 64KX8 MULTI DEVICE DRAM MODULE, 120ns, SMA30, 3.100 X 0.650 INCH, SIMM-30 | 64KX8 MULTI DEVICE DRAM MODULE, 200ns, SMA30, 3.100 X 0.650 INCH, SIMM-30 | 64KX8 MULTI DEVICE DRAM MODULE, 150ns, SMA30, 3.100 X 0.650 INCH, SIMM-30 | 64KX8 MULTI DEVICE DRAM MODULE, 150ns, SMA30, 3.500 X 0.600 INCH, SIMM-30 | 64KX8 MULTI DEVICE DRAM MODULE, 200ns, SMA30, 3.500 X 0.600 INCH, SIMM-30 |
零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
包装说明 | SIMM, SIM30 | 3.100 X 0.650 INCH, SIMM-30 | , SIP30,.2 | , SIP30,.2 | SIMM, SIM30 | SIMM, SIM30 |
针数 | 30 | 30 | 30 | 30 | 30 | 30 |
Reach Compliance Code | unknown | not_compliant | not_compliant | not_compliant | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE |
最长访问时间 | 120 ns | 120 ns | 200 ns | 150 ns | 150 ns | 200 ns |
其他特性 | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-N30 |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bi |
内存集成电路类型 | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 30 | 30 | 30 | 30 | 30 | 30 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装等效代码 | SIM30 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIM30 | SIM30 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 256 | 256 | 256 | 256 | 256 | 256 |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |