型号
- 型号
- 关键词
| 型号 | TMS27PC291-3FNL | TMS27C291-3JL | TMS27C291-35JL |
|---|---|---|---|
| 描述 | 2KX8 OTPROM, 35ns, PQCC28 | 2KX8 UVPROM, 35ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | 2KX8 UVPROM, 35ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Reach Compliance Code | unknown | unknown | unknown |
| 最长访问时间 | 35 ns | 35 ns | 35 ns |
| JESD-30 代码 | S-PQCC-J28 | R-CDIP-T24 | R-CDIP-T24 |
| 长度 | 11.5062 mm | 31.75 mm | 31.75 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | OTP ROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 |
| 字数 | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | WDIP | WDIP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 4.57 mm | 4.907 mm | 4.907 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL |
| 宽度 | 11.5062 mm | 7.62 mm | 7.62 mm |
| 零件包装代码 | - | DIP | DIP |
| 包装说明 | - | 0.600 INCH, WINDOWED, CERDIP-24 | 0.600 INCH, WINDOWED, CERDIP-24 |
| 针数 | - | 24 | 24 |