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TP2522N8-G

P-channel enhancement mode vertical dmos fets

器件类别:分立半导体    晶体管   

厂商名称:Supertex

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Supertex
零件包装代码
SOT-89
包装说明
SMALL OUTLINE, R-PSSO-F3
针数
3
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
LOW THRESHOLD, LOGIC LEVEL COMPATIBLE
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
220 V
最大漏极电流 (ID)
0.26 A
最大漏源导通电阻
12 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-243AA
JESD-30 代码
R-PSSO-F3
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
P-CHANNEL
最大脉冲漏极电流 (IDM)
2 A
认证状态
Not Qualified
表面贴装
YES
端子面层
Matte Tin (Sn)
端子形式
FLAT
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
文档预览
TP2522
P-Channel Enhancement Mode
Vertical DMOS FETs
Features
Low threshold — -2.4V max.
High input impedance
Low input capacitance — 125pF max.
Fast switching speeds
Low ON-resistance
Free from secondary breakdown
Low input and output leakage
Complementary N and P-channel devices
General Description
This low threshold enhancement-mode (normally-off)
transistor utilizes a vertical DMOS structure and Supertex’s
well-proven silicon-gate manufacturing process. This
combination produces a device with the power handling
capabilities of bipolar transistors and with the high input
impedance and positive temperature coefficient inherent
in MOS devices. Characteristic of all MOS structures,
this device is free from thermal runaway and thermally-
induced secondary breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a wide
range of switching and amplifying applications where very
low threshold voltage, high breakdown voltage, high input
impedance, low input capacitance, and fast switching
speeds are desired.
Applications
Logic level interfaces – ideal for TTL and CMOS
Solid state relays
Battery operated systems
Photo voltaic drives
Analog switches
General purpose line drivers
Telecom switches
Ordering Information
BV
DSS
/BV
DGS
(V)
R
DS(ON)
max
(Ω)
V
GS(th)
max
(V)
I
D(ON)
min
(A)
Package Options
TO-243AA (SOT-89)
TP2522N8-G
Die*
TP2522ND
-220
12
-2.4
-0.75
-G indicates package is RoHS compliant (‘Green’)
* MIL visual screening available.
Pin Configuration
DRAIN
Absolute Maximum Ratings
Parameter
Drain-to-source voltage
Drain-to-gate voltage
Gate-to-source voltage
Operating and storage temperature
Soldering temperature*
Value
BV
DSS
BV
DGS
±20V
-55°C to +150°C
300°C
GATE
SOURCE
DRAIN
TO-243AA (SOT-89) (N8)
Product Marking
TP5CW
W = Code for week sealed
Absolute Maximum Ratings are those values beyond which damage to
the device may occur. Functional operation under these conditions is not
implied. Continuous operation of the device at the absolute rating level
may affect device reliability. All voltages are referenced to device ground.
* Distance of 1.6 mm from case for 10 seconds.
TO-243AA (SOT-89) (N8)
TP2522
Thermal Characteristics
Package
TO-243AA (SOT-89)
(continuous)*
(mA)
I
D
(pulsed)
(A)
I
D
Power Dissipation
@ T
A
= 25
O
C
(W)
O
θ
jc
C/W
O
θ
j
a
C/W
I
DR
*
(mA)
I
DRM
(A)
-260
-2.0
1.6
15
78
-260
-2.0
* I
D
(continuous) is limited by max rated T
j
.
† Mounted on FR5 board, 25mm x 25mm x 1.57mm.
Electrical Characteristics
(T = 25°C unless otherwise specified)
A
Symbol
BV
DSS
V
GS(th)
∆V
GS(th)
I
GSS
I
DSS
Parameter
Drain-to-source breakdown voltage
Gate threshold voltage
Change in V
GS(th)
with temperature
Gate body leakage
Zero gate voltage drain current
Min
-220
-1.0
-
-
-
-0.25
-0.75
-
-
100
-
-
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
-0.7
-2.1
10
8.0
-
250
75
20
10
-
-
-
-
-
300
Max
-
-2.4
4.5
-100
-10
-1.0
-
-
15
12
1.7
-
125
85
35
10
15
20
15
-1.8
-
Units
V
V
mV/
O
C
nA
μA
mA
A
Ω
%/
O
C
mmho
pF
Conditions
V
GS
= 0V, I
D
= -2.0mA
V
GS
= V
DS
, I
D
= -1.0mA
V
GS
= V
DS
, I
D
= -1.0mA
V
GS
= ± 20V, V
DS
= 0V
V
GS
= 0V, V
DS
= Max Rating
V
GS
= 0V, V
DS
= 0.8 Max Rating,
T
A
= 125°C
V
GS
= -4.5V, V
DS
= -25V
V
GS
= -10V, V
DS
= -25V
V
GS
= -4.5V, I
D
= -100mA
V
GS
= -10V, I
D
= -200mA
V
GS
= -10V, I
D
= -200mA
V
DS
= -25V, I
D
= -200mA
V
GS
= 0V,
V
DS
= -25V,
f = 1.0 MHz
V
DD
= -25V,
I
D
= -0.75A,
R
GEN
= 25Ω
V
GS
= 0V, I
SD
= -0.5A
V
GS
= 0V, I
SD
= -0.5A
I
D(ON)
R
DS(ON)
∆R
DS(ON)
G
FS
C
ISS
C
OSS
C
RSS
t
d(ON)
t
r
t
d(OFF)
t
f
V
SD
t
rr
ON-state drain current
Static drain-to-source ON-State
resistance
Change in R
DS(ON)
with temperature
Forward transconductance
Input capacitance
Common source output capacitance
Reverse transfer capacitance
Turn-ON delay time
Rise time
Turn-OFF delay time
Fall time
Diode forward voltage drop
Reverse recovery time
ns
V
ns
Notes:
(1) All D.C. parameters 100% tested at 25
O
C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
(2) All A.C. parameters sample tested.
Switching Waveforms and Test Circuit
0V
10%
INPUT
-10V
PULSE
GENERATOR
90%
t
(OFF)
t
r
t
d(OFF)
t
F
INPUT
R
GEN
D.U.T.
Output
R
L
10%
t
(ON)
t
d(ON)
0V
90%
OUTPUT
V
DD
90%
10%
V
DD
2
TP2522
Typical Performance Curves
Output Characteristics
-2.5
-2.0
Saturation Characteristics
V
GS
= -10V
-2.0
-8V
-1.6
I
D
(amperes)
-1.5
I
D
(amperes)
V
GS
= -10V
-1.2
-6V
-1.0
-8V
-6V
-0.8
-0.5
-4V
-3V
-0.4
-4V
-3V
0
-2
-4
-6
-8
-10
0
0
-10
-20
-30
-40
-50
0
V
DS
Transconductance vs. Drain Current
1.0
2.0
V
DS
(volts)
Power Dissipation vs. Ambient Temperature
0.8
V
DS
= -25V
TO-243AA
G
FS
(siemens)
T
A
= -55°C
0.4
P
D
(watts)
0.6
1.0
T
A
= 25°C
T
A
= 125°C
0.2
0
0
-0.4
-0.8
-1.2
-1.6
-2.0
0
0
25
50
75
100
125
150
I
D
(amperes)
Maximum Rated Safe Operating Area
-10
1.0
T
A
(°C)
Thermal Response Characteristics
Thermal Resistance (normalized)
T
A
= 25°C
TO-243AA (pulsed)
I
D
(amperess)
-1.0
0.8
0.6
0.4
-0.1
TO-243AA (DC)
0.2
TO-243AA
T
A
= 25°C
P
D
= 1.6W
-0.01
-1
-10
-100
-1000
0
0.001
0.01
0.1
1
10
V
DS
t
P
(seconds)
3
TP2522
Typical Performance Curves
(cont.)
BV
DSS
Variation with Temperature
50
1.1
40
On-Resistance vs. Drain Current
BV
DSS
(normalized)
V
GS
= -4.5V
R
DS(ON)
(ohms)
30
1.0
20
V
GS
= -10V
10
0.9
0
-50
0
50
100
150
0
-0.5
-1.0
-1.5
-2.0
-2.5
T
j
(°C)
Transfer Characteristics
-2.5
1.2
-2.0
I
D
(amperes)
V
(th)
and R
DS
Variation with Temperature
2.5
V
DS
= -25V
V
GS(th)
(normalized)
2.0
25°C
1.1
-1.5
1.5
1.0
125°C
-1.0
V
(th)
@ -1mA
1.0
0.9
0.5
0.8
-0.5
0
0
-2
-4
-6
-8
-10
-50
0
50
100
150
0
V
GS
(volts)
Capacitance vs. Drain-to-Source Voltage
200
-10
T
j
(°C)
Gate Drive Dynamic Characteristics
f = 1MHz
-8
150
V
DS
= -10V
C (picofarads)
V
GS
(volts)
-6
100
V
DS
= -40V
-4
C
ISS
50
200pF
-2
C
RSS
0
0
-10
-20
-30
C
OSS
0
-40
0
73pF
0.5
1.0
1.5
2.0
2.5
V
DS
(volts)
Q
G
(nanocoulombs)
4
R
DS(ON)
(normalized)
T
A
= -55°C
I
D
(amperes)
R
DS(ON)
@ -10V, -0.2A
TP2522
3-Lead TO-243AA (SOT-89) Package Outline (N8)
Symbol
MIN
Dimensions
(mm)
NOM
MAX
A
1.40
-
1.60
b
0.44
-
0.56
b1
0.36
-
0.48
C
0.35
-
0.44
D
4.40
-
4.60
D1
1.62
-
1.83
E
2.29
-
2.60
E1
2.13
-
2.29
e
1.50
BSC
e1
3.00
BSC
H
3.94
-
4.25
L
0.89
-
1.20
JEDEC Registration TO-243, Variation AA, Issue C, July 1986.
Drawings not to scale.
Doc.# DSFP - TP2522
A101507
5
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