TS391SNL50
Datasheet revision 1.0
www.chipquik.com
Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (50g Jar)
Product Highlights
Revolutionary Formula:
No Refrigeration Required!
Printing speeds up to 125mm/sec
Long stencil life
Wide process window
Clear residue
Specifications
Alloy:
Mesh Size:
Micron (µm) Range:
Flux Type:
Flux Classification:
Metal Load:
Melting Point:
Packaging:
Shelf Life:
Low voiding
Excellent wetting compatibility on most board finishes
Print grade
Compatible with enclosed print heads
RoHS II and REACH compliant
Sn96.5/Ag3.0/Cu0.5
T4
20-38
Synthetic No-Clean
ROL0
88.5% Metal by Weight
217-220°C (423-428°F)
50g Jar
Refrigerated >12 months, Unrefrigerated >12 months
*See
notes below:
*Shelf
Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
thoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
Print Speed: 25-125mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>12 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store at room temperature 20-25°C (68-77°F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its
operating temperature (room temperature) of 20-25°C (68-77°F), therefore no warming time is required before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
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© 1994-2017 Chip Quik® Inc.
Recommended Profile
Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization.
249°C (480°F)
217°C (423°F)
175°C (347°F)
Temperature
150°C (302°F)
25°C (77°F)
0sec
90sec
180sec
Time
210sec
240sec
270sec
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Tack Value
Viscosity – Malcom @ 10 RPM/25°C
3
(x10 mPa/s)
Visual
Conflict Minerals Compliance
REACH Compliance
Test Requirement
IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
IPC-TM-650: 2.6.3.7
IPC-TM-650: 2.4.44
IPC-TM-650: 2.4.34.4
IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
L: No breakthrough
L: No corrosion
L: <0.5%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)
33g
Print: 140-195, Dispense: 115-160
Clear and free from precipitation
Compliant
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-005A (Solder Pastes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
Yes
Yes
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© 1994-2017 Chip Quik® Inc.
