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TS972IQT

Operational Amplifiers - Op Amps Output rail to rail Lo noise Op Amp

器件类别:模拟混合信号IC    放大器电路   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

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器件参数
参数名称
属性值
Brand Name
STMicroelectronics
厂商名称
ST(意法半导体)
零件包装代码
DFN
包装说明
HVSSON, SOLCC8,.11,20
针数
8
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
12 weeks
放大器类型
OPERATIONAL AMPLIFIER
架构
VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)
1 µA
25C 时的最大偏置电流 (IIB)
0.75 µA
标称共模抑制比
85 dB
频率补偿
YES
最大输入失调电压
7000 µV
JESD-30 代码
S-PDSO-N8
JESD-609代码
e3
长度
3 mm
低-偏置
NO
低-失调
NO
微功率
NO
湿度敏感等级
1
负供电电压上限
-6 V
标称负供电电压 (Vsup)
-2.5 V
功能数量
2
端子数量
8
最高工作温度
125 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
HVSSON
封装等效代码
SOLCC8,.11,20
封装形状
SQUARE
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
包装方法
TAPE AND REEL
峰值回流温度(摄氏度)
260
功率
NO
电源
+-2.5 V
可编程功率
NO
认证状态
Not Qualified
座面最大高度
1 mm
最小摆率
2.8 V/us
标称压摆率
4 V/us
最大压摆率
5.6 mA
供电电压上限
6 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
BIPOLAR
温度等级
AUTOMOTIVE
端子面层
MATTE TIN
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
标称均一增益带宽
12000 kHz
最小电压增益
3160
宽带
NO
宽度
3 mm
文档预览
TS971, TS972, TS974
Output rail-to-rail very low noise operational amplifier
Datasheet - production data
Features
Rail-to-rail output voltage swing ±2.4 V at
V
CC
= ±2.5 V
Very low noise level: 4 nV/√Hz
Ultra low distortion: 0.003 %
High dynamic features: 12 MHz, 4 V/µs
Operating range: 2.7 to 10 V
ESD protection (2 kV)
Latch-up immunity (class A)
Applications
Portable devices (CD players, PDAs)
Portable communication
(cell phones, pagers)
Instrumentation and sensing technology
Professional audio circuits
Description
The TS97x family of operational amplifiers
operate with voltages as low as ±1.35 V and
feature output rail-to-rail signal swing. The TS97x
devices are particularly well suited for portable
and battery-supplied equipment. Very low noise
and low distortion characteristics make them
ideal for audio pre-amplification.
The TS97x devices are available in a variety of
packages to suit all types of applications. For
applications where space saving is critical, the
SOT23-5 package (2.8 x 2.9 mm) or the DFN8
package (3 x 3 mm) simplify the board design
because they can be placed anywhere on it.
June 2016
DocID6031 Rev 11
1/18
www.st.com
This is information on a product in full production.
Contents
TS971, TS972, TS974
Contents
1
2
3
4
5
Package pin connections................................................................ 3
Absolute maximum ratings and operating conditions ................. 4
Electrical characteristics ................................................................ 6
Electrical characteristic curves ...................................................... 7
Package information ....................................................................... 9
5.1
5.2
5.3
5.4
5.5
5.6
SOT23-5 package information ........................................................ 10
SO8 package information ................................................................ 11
TSSOP8 package information ......................................................... 12
DFN8 3x3 exposed pad package information ................................. 13
SO14 package information .............................................................. 14
TSSOP14 package information ....................................................... 15
6
7
Ordering information..................................................................... 16
Revision history ............................................................................ 17
2/18
DocID6031 Rev 11
TS971, TS972, TS974
Package pin
connections
1
Package pin connections
Figure 1: Package pin connections
1.
The exposed pad of the DFN8 3x3 can be connected to VCC or left floating
DocID6031 Rev 11
3/18
Absolute maximum
ratings and operating
conditions
TS971, TS972, TS974
2
Absolute maximum ratings and operating conditions
Table 1: Absolute maximum ratings (AMR)
Symbol
V
CC
V
id
V
in
T
stg
T
j
Supply voltage
(1)
Differential input voltage
(2)
Input voltage
(3)
Storage temperature range
Maximum junction temperature
SOT23-5
SO8
R
thja
Thermal resistance junction-to-ambient
(4)
TSSOP8
DFN8 3x3
SO14
TSSOP14
SOT23-5
SO8
R
thjc
Thermal resistance junction-to-case
(4)
TSSOP8
DFN8 3x3
SO14
TSSOP14
HBM: human body model
ESD
MM: machine model
(6)
CDM: charged device model
(7) (8)
(5)
Parameter
Value
12
±1
V
DD
- 0.3 to V
CC
+ 0.3
-65 to 150
150
250
125
120
40
105
100
Unit
V
°C
°C/W
81
40
37
5.2
31
32
2
200
1.5
260
kV
V
kV
°C
Lead temperature (soldering, 10 sec.)
Notes:
(1)
All
voltage values, except the differential voltage are with respect to the network ground terminal.
differential voltage is the non-inverting input terminal with respect to the inverting input terminal.
magnitude of input and output voltages must never exceed V
CC
+ 0.3 V.
(2)
The
(3)
The
(4)
Short-circuits can cause excessive heating and destructive dissipation. Values are typical.
(5)
Human
body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ
resistor between two pins of the device. This is done for all couples of connected pin combinations while the other
pins are floating.
(6)
Machine
model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two
pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected
pin combinations while the other pins are floating.
(7)
No value specified for CDM on SOT23-5 package.
(8)
Charged
device model: all pins and package are charged together to the specified voltage and then discharged
directly to ground through only one pin. This is done for all pins.
4/18
DocID6031 Rev 11
TS971, TS972, TS974
Absolute maximum
ratings and operating
conditions
Table 2: Operating conditions
Symbol
V
CC
V
icm
T
oper
Supply voltage
Parameter
Value
2.7 to 10
V
DD
+ 1.15 to V
CC
- 1.15
-40 to 125
Unit
V
°C
Common mode input voltage range
Operating free air temperature range
DocID6031 Rev 11
5/18
查看更多>
参数对比
与TS972IQT相近的元器件有:TS974IYDT、TS972IPT、TS974IPT、TS972IST、TS972ID、TS974IDT、TS974ID、TS972IN、TS971ID。描述及对比如下:
型号 TS972IQT TS974IYDT TS972IPT TS974IPT TS972IST TS972ID TS974IDT TS974ID TS972IN TS971ID
描述 Operational Amplifiers - Op Amps Output rail to rail Lo noise Op Amp Operational Amplifiers - Op Amps Output rail to rail Lo noise Op Amp Operational Amplifiers - Op Amps Dual Lo-Noise R-to-R Operational Amplifiers - Op Amps Quad Lo-Noise R-to-R Operational Amplifiers - Op Amps Low Noise Op Amp 2.7-10V 12MHz Operational Amplifiers - Op Amps Dual Lo-Noise R-to-R Operational Amplifiers - Op Amps Quad Lo-Noise R-to-R Operational Amplifiers - Op Amps Quad Lo-Noise R-to-R Operational Amplifiers - Op Amps Dual Lo-Noise R-to-R Operational Amplifiers - Op Amps Single Low-Noise
Brand Name STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
零件包装代码 DFN SOIC SOIC TSSOP SOIC SOIC SOIC SOIC DIP SOIC
包装说明 HVSSON, SOLCC8,.11,20 SOP, SOP14,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP14,.25 TSSOP, TSSOP8,.19 LEAD FREE, SO-8 SOP-14 SOP, SOP14,.25 LEAD FREE, PLASTIC, DIP-8 LEAD FREE, SO-8
针数 8 14 8 14 8 8 14 14 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant unknown compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB) 1 µA 1 µA 1 µA 1 µA 1 µA 1 µA 1 µA 1 µA 1 µA 1 µA
25C 时的最大偏置电流 (IIB) 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA 0.75 µA
标称共模抑制比 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB
频率补偿 YES YES YES YES YES YES YES YES YES YES
最大输入失调电压 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV 7000 µV
JESD-30 代码 S-PDSO-N8 R-PDSO-G14 R-PDSO-G8 R-PDSO-G14 S-PDSO-G8 R-PDSO-G8 R-PDSO-G14 R-PDSO-G14 R-PDIP-T8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e4 e3 e4 e4 e4 e3 e4
低-失调 NO NO NO NO NO NO NO NO NO NO
负供电电压上限 -6 V -6 V -6 V -6 V -6 V -6 V -6 V -6 V -6 V -6 V
标称负供电电压 (Vsup) -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V -2.5 V
功能数量 2 4 2 4 2 2 4 4 2 1
端子数量 8 14 8 14 8 8 14 14 8 8
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSSON SOP TSSOP TSSOP TSSOP SOP SOP SOP DIP SOP
封装等效代码 SOLCC8,.11,20 SOP14,.25 TSSOP8,.25 TSSOP14,.25 TSSOP8,.19 SOP8,.25 SOP14,.25 SOP14,.25 DIP8,.3 SOP8,.25
封装形状 SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 NOT SPECIFIED NOT SPECIFIED 260 260 260 NOT SPECIFIED 260
电源 +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V +-2.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1.75 mm 1.2 mm 1.2 mm 1.1 mm 1.75 mm 1.75 mm 1.75 mm 4.8 mm 1.75 mm
最小摆率 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us 2.8 V/us
标称压摆率 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us
最大压摆率 5.6 mA 11.2 mA 5.6 mA 11.2 mA 5.6 mA 5.6 mA 11.2 mA 11.2 mA 5.6 mA 2.8 mA
供电电压上限 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES YES YES NO YES
技术 BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 MATTE TIN Tin (Sn) Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 NO LEAD GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING
端子节距 0.5 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 40 10 NOT SPECIFIED NOT SPECIFIED 30 30 30 NOT SPECIFIED 30
标称均一增益带宽 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz 12000 kHz
最小电压增益 3160 3160 3160 3160 3160 3160 3160 3160 3160 3160
宽度 3 mm 3.9 mm 3 mm 4.4 mm 3 mm 3.9 mm 3.9 mm 3.9 mm 7.62 mm 3.9 mm
厂商名称 ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) - ST(意法半导体) ST(意法半导体) ST(意法半导体)
长度 3 mm 8.65 mm 4.4 mm 5 mm 3 mm 4.9 mm 8.65 mm 8.65 mm - 4.9 mm
低-偏置 NO - NO - NO NO - - NO NO
微功率 NO - NO - NO NO - - NO NO
湿度敏感等级 1 1 1 - 1 1 1 1 - 1
包装方法 TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TUBE TAPE AND REEL TUBE TUBE -
功率 NO - NO - NO NO - - NO NO
可编程功率 NO - NO - NO NO - - NO NO
宽带 NO - NO - NO NO - - NO NO
是否Rohs认证 - 符合 - 符合 - 符合 符合 符合 符合 符合
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