This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors with built-in Resistor
UNR31A8
Silicon NPN epitaxial planar type
For digital circuits
Features
Suitable for high-density mounting and downsizing of the equipment
Contribute to low power consumption
Package
Code
SSSMini3-F1
Name
Pin
1: Base
2: Emitter
3: Collector
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector current
Total power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
I
C
P
T
T
j
T
stg
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Symbol
V
CBO
V
CEO
I
CBO
I
CEO
I
EBO
h
FE
Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Collector-emitter saturation voltage
Output voltage high-level
Output voltage low-level
Resistance ratio
Input resistance
Forward current transfer ratio
nt
in
Collector-base cutoff current (Emitter open)
an
ce
V
CE(sat)
V
OH
V
OL
R
1
f
T
Transition frequency
Pl
e
R
1
/ R
2
M
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
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:// g nt n ce c g
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e Pr
od
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uc
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d
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ife
t/s e
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c/ st
en in
cl
e
fo
st
rm
ag
at
e.
io
n.
Rating
–50
–50
–80
100
125
Unit
V
V
M
Di ain
sc te
on na
tin nc
ue e/
d
mA
°C
°C
mW
–55 to +125
B
Marking Symbol: KS
Internal Connection
R
1
(0.51 kΩ)
R
2
(5.1 kΩ)
C
E
Conditions
Min
–50
–50
Typ
Max
Unit
V
V
I
C
= –10
mA,
I
E
= 0
I
C
= –2 mA, I
B
= 0
ue
V
CB
= –50 V, I
E
= 0
V
EB
= –6 V, I
C
= 0
– 0.1
– 0.5
–2.0
mA
V
CE
= –50 V, I
B
= 0
mA
co
mA
V
V
is
/D
V
CE
= –10 V, I
C
= –5 mA
20
I
C
= –10 mA, I
B
= – 0.3 mA
– 0.25
– 0.2
0.12
V
CC
= –5 V, V
B
= – 0.5 V, R
L
= 1 kW
–4.9
en
nt
V
CC
= –5 V, V
B
= – 2.5 V, R
L
= 1 kW
V
ai
–30%
0.08
0.51
0.10
80
+30%
kW
V
CB
= –10 V, I
E
= 1 mA, f = 200 MHz
MHz
Publication date: November 2008
SJH00260AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
UNR31A8
SSSMini3-F1
Unit: mm
0.33
−0.02
+0.05
0.10
−0.02
+0.05
3
0.80
±0.05
1.20
±0.05
1
0.23
+0.05
−0.02
2
0.15 min.
(0.40)
(0.40)
0.80
±0.05
1.20
±0.05
5°
0.15 min.
0.15 max.
5
°
0.52
±0.03
2
SJH00260AED
0 to 0.01
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semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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