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UNR32A1

Composite Transistors Silicon NPN epitaxial planar type

器件类别:分立半导体    晶体管   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Panasonic(松下)
包装说明
SMALL OUTLINE, R-PDSO-F3
针数
3
Reach Compliance Code
unknow
ECCN代码
EAR99
其他特性
BUILT IN BIAS RESISTOR RATIO IS 1
最大集电极电流 (IC)
0.08 A
集电极-发射极最大电压
50 V
配置
SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)
35
JESD-30 代码
R-PDSO-F3
JESD-609代码
e6
湿度敏感等级
1
元件数量
1
端子数量
3
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
NPN
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin/Bismuth (Sn/Bi)
端子形式
FLAT
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
标称过渡频率 (fT)
150 MHz
文档预览
Composite Transistors
NP062A1
Silicon NPN epitaxial planar type
Unit: mm
For digital circuits
6
0.12
+0.03
-0.02
5
4
0.80
±0.05
1.00
±0.05
Features
Two elements incorporated into one package
Suitable for high-density mounting and downsizing of the equipment
Contribute to low power consumption
1
2
1.00
±0.05
3
0 to 0.02
(0.35) (0.35)
Basic Part Number
UNR32A1
×
2
Display at No.1 lead
0.10
0.10
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector current
Total power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
I
C
P
T
T
j
T
stg
Rating
50
50
80
125
125
−55
to
+125
Unit
V
V
mA
mW
°C
°C
1: Emitter (Tr1)
2: Emitter (Tr2)
3: Base (Tr2)
0.37
+0.03
-0.02
4: Collector (Tr2)
5: Base (Tr1)
6: Collector (Tr1)
SSSMini6-F1 Package
Marking Symbol: 7Z
Internal Connection
6
Tr1
5
4
Note) *: Measuring on substrate at 17 mm
×
10 mm
×
1 mm
Tr2
Electrical Characteristics
T
a
=
25°C
±
3°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
h
FE
Ratio
*
Collector-emitter saturation voltage
Output voltage high level
Output voltage low level
Input resistance
Resistance ratio
Transition frequency
Symbol
V
CBO
V
CEO
I
CBO
I
CEO
I
EBO
h
FE
h
FE(Small/
Large)
1
2
3
Conditions
I
C
=
10
µA,
I
E
=
0
I
C
=
2 mA, I
B
=
0
V
CB
=
50 V, I
E
=
0
V
CE
=
50 V, I
B
=
0
V
EB
=
6 V, I
C
=
0
V
CE
=
10 V, I
C
=
5 mA
V
CE
=
10 V, I
C
=
5 mA
I
C
=
10 mA, I
B
=
0.3 mA
V
CC
=
5 V, V
B
=
0.5 V, R
L
=
1 kΩ
V
CC
=
5 V, V
B
=
2.5 V, R
L
=
1 kΩ
Min
50
50
Typ
Max
Unit
V
V
µA
µA
mA
0.1
0.5
0.5
35
0.5
0.99
0.25
4.9
0.2
−30%
0.8
10
1.0
150
+30%
1.2
V
CE(sat)
V
OH
V
OL
R
1
R
1
/ R
2
f
T
V
V
V
kΩ
MHz
V
CB
=
10 V, I
E
= −2
mA, f
=
200 MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Ratio between one and another
(0.10)
Publication date: June 2003
SJJ00271BED
1
NP062A1
P
T
T
a
140
120
I
C
V
CE
0.9
mA
70
0.8
mA
0.7
mA
0.6
mA
0.5
mA
0.4
mA
0.3
mA
V
CE(sat)
I
C
Collector-emitter saturation voltage V
CE(sat)
(V)
I
B
=
1.0 mA
10
80
Total power dissipation P
T
(mW)
Collector current I
C
(mA)
100
80
60
40
20
0
60
50
40
30
20
10
0
1
0.2
mA
T
a
=
85°C
0.1
−25°C
0.1
mA
T
a
=
25°C
25°C
I
C
/ I
B
=
10
0.01
1
10
100
1 000
0
20
40
60
80
100 120 140
0
2
4
6
8
10
12
Ambient temperature T
a
(°C)
Collector-emitter voltage V
CE
(V)
Collector current I
C
(mA)
h
FE
I
C
Collector output capacitance
C (pF)
(Common base, input open circuited)
ob
250
V
CE
=
10 V
T
a
=
85°C
C
ob
V
CB
10
f
=
1 MHz
T
a
=
25°C
100
I
O
V
IN
V
O
=
5 V
T
a
=
25°C
Forward current transfer ratio h
FE
200
Output current I
O
(mA)
1
0
5
10
15
20
25
30
35
40
25°C
150
10
100
−25°C
1
50
0
1
10
100
0.1
0
0.5
1.0
1.5
2.0
2.5
Collector current I
C
(mA)
Collector-base voltage V
CB
(V)
Input voltage V
IN
(V)
V
IN
I
O
100
V
O
=
0.2 V
T
a
=
25°C
Input voltage V
IN
(V)
10
1
0.1
1
10
100
Output current I
O
(mA)
2
SJJ00271BED
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL
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参数对比
与UNR32A1相近的元器件有:NP062A1。描述及对比如下:
型号 UNR32A1 NP062A1
描述 Composite Transistors Silicon NPN epitaxial planar type Composite Transistors Silicon NPN epitaxial planar type
是否Rohs认证 符合 符合
厂商名称 Panasonic(松下) Panasonic(松下)
包装说明 SMALL OUTLINE, R-PDSO-F3 SMALL OUTLINE, R-PDSO-F6
针数 3 6
Reach Compliance Code unknow unknow
ECCN代码 EAR99 EAR99
其他特性 BUILT IN BIAS RESISTOR RATIO IS 1 BUILT IN BIAS RESISTOR RATIO IS 1
最大集电极电流 (IC) 0.08 A 0.08 A
集电极-发射极最大电压 50 V 50 V
配置 SINGLE WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE) 35 35
JESD-30 代码 R-PDSO-F3 R-PDSO-F6
JESD-609代码 e6 e6
湿度敏感等级 1 1
元件数量 1 2
端子数量 3 6
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 NPN NPN
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子面层 Tin/Bismuth (Sn/Bi) Tin/Bismuth (Sn/Bi)
端子形式 FLAT FLAT
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
标称过渡频率 (fT) 150 MHz 150 MHz
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