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UNRF1A5

Small Signal Bipolar Transistor, 0.08A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, 0.60 X 1 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, ULTRAMINIATURE, LEADLESS, ML3-N2, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:Panasonic(松下)

厂商官网:http://www.panasonic.co.jp/semicon/e-index.html

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Panasonic(松下)
包装说明
CHIP CARRIER, R-XBCC-N3
针数
3
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
BUILT IN BIAS RESISTOR
外壳连接
COLLECTOR
最大集电极电流 (IC)
0.08 A
集电极-发射极最大电压
50 V
配置
SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)
160
JESD-30 代码
R-XBCC-N3
JESD-609代码
e6
湿度敏感等级
1
元件数量
1
端子数量
3
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
PNP
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin/Bismuth (Sn/Bi)
端子形式
NO LEAD
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
标称过渡频率 (fT)
80 MHz
文档预览
Transistors with built-in Resistor
UNRF1A5
Silicon PNP epitaxial planar transistor
Unit: mm
For digital circuits
0.60
±0.05
Features
Suitable for high-density mounting and downsizing of the equip-
ment for Ultraminiature leadless package
0.6 mm
×
1.0 mm (height 0.39 mm)
3
2
1
1.00
±0.05
0.39
+0.01
−0.03
0.15
±0.05
0.05
±0.03
0.35
±0.01
0.25
±0.05
0.25
±0.05
1
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector current
Total power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
I
C
P
T
T
j
T
stg
Rating
−50
−50
−80
100
125
−55
to
+125
Unit
V
V
mA
mW
°C
°C
0.50
±0.05
3
0.65
±0.01
2
0.05
±0.03
1: Base
2: Emitter
3: Collector
ML3-N2 Package
Marking Symbol: 2X
Internal Connection
R
1
(10 kΩ)
B
C
E
Electrical Characteristics
T
a
=
25°C
±
3°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
Collector-emitter saturation voltage
Output voltage high level
Output voltage low level
Input resistance
Transition frequency
Symbol
V
CBO
V
CEO
I
CBO
I
CEO
I
EBO
h
FE
V
CE(sat)
V
OH
V
OL
R
1
f
T
V
CB
= −10
V, I
E
=
1 mA, f
=
200 MHz
Conditions
I
C
= −10 µA,
I
E
=
0
I
C
= −2
mA, I
B
=
0
V
CB
= −50
V, I
E
=
0
V
CE
= −50
V, I
B
=
0
V
EB
= −6
V, I
C
=
0
V
CE
= −10
V, I
C
= −5
mA
I
C
= −10
mA, I
B
= −
0.3 mA
V
CC
= −5
V, V
B
= −
0.5 V, R
L
=
1 kΩ
V
CC
= −5
V, V
B
= −2.5
V, R
L
=
1 kΩ
−30%
10
80
−4.9
0.2
+30%
160
Min
−50
−50
0.1
0.5
0.01
460
0.25
Typ
Max
Unit
V
V
µA
µA
mA
V
V
V
kΩ
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: December 2002
SJH00069AED
1
UNRF1A5
P
T
T
a
120
−100
−90
T
a
=
25°C
I
C
V
CE
Collector-emitter saturation voltage V
CE(sat)
(V)
−100
0.9 mA I
B
= −1.0
mA
0.8 mA
0.7 mA
−80
0.6 mA
−70 −
0.5 mA
0.4 mA
−60
−50
−40
−30
−20
−10
0.1 mA
0.3 mA
0.2 mA
V
CE(sat)
I
C
I
C
/ I
B
= 10
Total power dissipation P
T
(mW)
100
80
Collector current I
C
(mA)
−10
T
a
=
85°C
−1
−25°C
25°C
60
40
0.1
20
0
0
20
40
60
80
100 120 140
0
0
Ambient temperature T
a
(
°C
)
−2
−4
−6
−8
−10
−12
0.01
−1
−10
−100
Collector-emitter voltage V
CE
(V)
Collector current I
C
(mA)
h
FE
I
C
Collector output capacitance
C (pF)
(Common base, input open circuited)
ob
450
400
T
a
=
85°C
V
CE
= −10
V
C
ob
V
CB
10
f
=
1 MHz
T
a
= 25°C
−100
V
O
= −5
V
T
a
= 25°C
I
O
V
IN
Forward current transfer ratio h
FE
Output current I
O
(mA)
1
350
300
250
200
150
100
50
0
−1
−10
−100
25°C
−25°C
−10
−1
0
−5 −10 −15 −20 −25 −30 −35 −40
0.1
0
0.5
−1.0
−1.5
−2.0
−2.5
−3.0
Collector current I
C
(mA)
Collector-base voltage V
CB
(V)
Input voltage V
IN
(V)
V
IN
I
O
−100
V
O
= −
0.2 V
T
a
= 25°C
Input voltage V
IN
(V)
−10
−1
0.1
0.1
−1
−10
−100
Output current I
O
(mA)
2
SJH00069AED
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL
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