W25Q64CV
3V 64M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
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Publication Release Date: April 01, 2011
Revision C
W25Q64CV
Table of Contents
1.
2.
3.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES ....................................................................................................................................... 5
PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
4.
4.1
4.2
4.3
4.4
4.5
5.
6.
Pin Configuration SOIC 208-mil ........................................................................................... 6
Pad Configuration WSON 6x5-mm / 8X6-mm ..................................................................... 6
Pin Configuration PDIP 300-mil ............................................................................................ 7
Pin Description SOIC 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil ............................... 7
Pin Configuration SOIC 300-mil ........................................................................................... 8
Pin Description SOIC 300-mil ............................................................................................... 8
Ball Configuration TFBGA 8x6-mm ...................................................................................... 9
Ball Description TFBGA 8x6-mm ......................................................................................... 9
Chip Select (/CS) ................................................................................................................ 10
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10
Write Protect (/WP) ............................................................................................................ 10
HOLD (/HOLD) ................................................................................................................... 10
Serial Clock (CLK) .............................................................................................................. 10
PIN DESCRIPTIONS ...................................................................................................................... 10
BLOCK DIAGRAM .......................................................................................................................... 11
FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12
6.1
SPI OPERATIONS ............................................................................................................. 12
6.1.1
6.1.2
6.1.3
6.1.4
Standard SPI Instructions..................................................................................................... 12
Dual SPI Instructions ............................................................................................................ 12
Quad SPI Instructions .......................................................................................................... 12
Hold Function ....................................................................................................................... 12
Write Protect Features ......................................................................................................... 13
6.2
7.
WRITE PROTECTION ....................................................................................................... 13
6.2.1
STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14
7.1
STATUS REGISTERS........................................................................................................ 14
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
BUSY Status (BUSY) ........................................................................................................... 14
Write Enable Latch Status (WEL) ........................................................................................ 14
Block Protect Bits (BP2, BP1, BP0) ..................................................................................... 14
Top/Bottom Block Protect Bit (TB) ....................................................................................... 14
Sector/Block Protect Bit (SEC) ............................................................................................. 14
Complement Protect Bit (CMP) ............................................................................................ 14
Status Register Protect Bit (SRP1, SRP0) ........................................................................... 15
Erase/Program Suspend Status (SUS) ................................................................................ 15
Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 15
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W25Q64CV
7.1.10
7.1.11
7.1.12
Quad Enable Bit (QE)......................................................................................................... 15
Status Register Memory Protection (CMP = 0) .................................................................. 17
Status Register Memory Protection (CMP = 1) .................................................................. 18
Manufacturer and Device Identification ................................................................................ 19
Instruction Set Table 1 (Erase, Program Instructions) ......................................................... 20
Instruction Set Table 2 (Read Instructions) .......................................................................... 21
Instruction Set Table 3 (ID, Security Instructions) ................................................................ 22
Write Enable (06h) ............................................................................................................... 23
Write Enable for Volatile Status Register (50h).................................................................... 23
Write Disable (04h) .............................................................................................................. 24
Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 25
Write Status Register (01h) .................................................................................................. 25
Read Data (03h) ................................................................................................................. 27
Fast Read (0Bh) ................................................................................................................. 28
Fast Read Dual Output (3Bh) ............................................................................................. 29
Fast Read Quad Output (6Bh) ........................................................................................... 30
Fast Read Dual I/O (BBh) .................................................................................................. 31
Fast Read Quad I/O (EBh) ................................................................................................. 33
Word Read Quad I/O (E7h) ................................................................................................ 35
Octal Word Read Quad I/O (E3h) ...................................................................................... 37
Set Burst with Wrap (77h) .................................................................................................. 39
Continuous Read Mode Bits (M7-0) ................................................................................... 40
Continuous Read Mode Reset (FFh or FFFFh).................................................................. 40
Page Program (02h) ........................................................................................................... 41
Quad Input Page Program (32h) ........................................................................................ 42
Sector Erase (20h) ............................................................................................................. 43
32KB Block Erase (52h) ..................................................................................................... 44
64KB Block Erase (D8h) .................................................................................................... 45
Chip Erase (C7h / 60h)....................................................................................................... 46
Erase / Program Suspend (75h)......................................................................................... 47
Erase / Program Resume (7Ah) ......................................................................................... 48
Power-down (B9h) .............................................................................................................. 49
Release Power-down / Device ID (ABh)............................................................................. 50
Read Manufacturer / Device ID (90h) ................................................................................. 52
Read Manufacturer / Device ID Dual I/O (92h)................................................................... 53
Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 54
Read Unique ID Number (4Bh) .......................................................................................... 55
Read JEDEC ID (9Fh) ........................................................................................................ 56
Read SFDP Register (5Ah) ................................................................................................ 57
Erase Security Registers (44h) .......................................................................................... 60
7.2
INSTRUCTIONS................................................................................................................. 19
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
7.2.10
7.2.11
7.2.12
7.2.13
7.2.14
7.2.15
7.2.16
7.2.17
7.2.18
7.2.19
7.2.20
7.2.21
7.2.22
7.2.23
7.2.24
7.2.25
7.2.26
7.2.27
7.2.28
7.2.29
7.2.30
7.2.31
7.2.32
7.2.33
7.2.34
7.2.35
7.2.36
7.2.37
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Publication Release Date: April 01, 2011
Revision C
W25Q64CV
7.2.38
7.2.39
Program Security Registers (42h) ...................................................................................... 61
Read Security Registers (48h) ........................................................................................... 62
8.
ELECTRICAL CHARACTERISTICS ............................................................................................... 63
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
Absolute Maximum Ratings ................................................................................................ 63
Operating Ranges............................................................................................................... 63
Power-up Timing and Write Inhibit Threshold .................................................................... 64
DC Electrical Characteristics .............................................................................................. 65
AC Measurement Conditions .............................................................................................. 66
AC Electrical Characteristics .............................................................................................. 67
AC Electrical Characteristics (cont’d) ................................................................................. 68
Serial Output Timing ........................................................................................................... 69
Serial Input Timing .............................................................................................................. 69
/HOLD Timing ..................................................................................................................... 69
/WP Timing ......................................................................................................................... 69
8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 70
8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71
8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72
8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74
16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75
24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76
Valid Part Numbers and Top Side Marking ........................................................................ 78
9.
PACKAGE SPECIFICATION .......................................................................................................... 70
9.1
9.2
9.3
9.4
9.5
9.6
10.
11.
ORDERING INFORMATION .......................................................................................................... 77
10.1
REVISION HISTORY ...................................................................................................................... 79
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W25Q64CV
1. GENERAL DESCRIPTION
The W25Q64CV (64M-bit) Serial Flash memory provides a storage solution for systems with limited
space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash
devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)
and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current
consumption as low as 4mA active and 1µA for power-down.
The W25Q64CV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64CV
has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater
flexibility in applications that require data and parameter storage. (See figure 2.)
The W25Q64CV supports the standard Serial Peripheral Interface (SPI), and a high performance
Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1
(DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing
equivalent clock rates of 160MHz (80MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when
using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP
(execute in place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,
provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and
device identification with a 64-bit Unique Serial Number.
2. FEATURES
•
Family of SpiFlash Memories
– W25Q64CV: 64M-bit / 8M-byte (8,388,608)
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO
0
, IO
1
, /WP, /Hold
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
•
Highest Performance Serial Flash
– 80MHz Dual/Quad SPI clocks
– 160/320MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– Up to 8X that of ordinary Serial Flash
(1)
– More than 100,000 erase/program cycles
– More than 20-year data retention
•
Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
•
Efficient “Continuous Read Mode”
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
•
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4/32/64K-bytes)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
•
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
•
Space Efficient Packaging
– 8-pin SOIC 208-mil
(2)
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options
Note 1. More than 100,000 Block Erase/Program cycles for Industrial and Automotive temperature; more than
10,000 full chip Erase/Program cycles tested in compliance with AEC-Q100.
2. WSON 8x6-mm is a special order package, please contact Winbond for ordering information.
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Publication Release Date: April 01, 2011
Revision C
