首页 > 器件类别 > 无源元件

WBC-R0202AS-03-3651-J

Resistor Networks u0026 Arrays

器件类别:无源元件   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

下载文档
WBC-R0202AS-03-3651-J 在线购买

供应商:

器件:WBC-R0202AS-03-3651-J

价格:-

最低购买:-

库存:点击查看

点击购买

器件参数
参数名称
属性值
产品种类
Product Category
Resistor Networks & Arrays
制造商
Manufacturer
TT Electronics plc
文档预览
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
Wire Bondable
Wire Bondable
Chip Resistors
Chip Resistors
WBC Series
Power Derating Data
TCR/Inspection Code Table
Absolute TCR
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
Commercial
Code
00
01
02
03
MIL Inspection
Code*
04
05
06
07
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection
Manufacturing Capabilities Data
Resistance Range
Resistance Range
10Ω - 20Ω
21Ω - 50Ω
10Ω - 20Ω
51Ω - 100Ω
101Ω - 200Ω
201Ω - 500Ω
Available Ratio Tol
Available Absolute
Available Abs
Available Ratio
Package
Tolerances
(T0303 only)
Tolerances
Tolerances (T0303 only)
0202 only
GJK
N/A
0202 and 0303
K
GJ
0202 and 0303
0202 and 0303
0202 and 0303
FGJK
CDFGJK
CDFGJK
BCDFGJK
BCDFGJK
BCDFGJK
BCDFGJK
Best Absolute TCR
TCR
+-100ppm/C
+-100ppm/C
±100ppm/°C
+-100ppm/C
+-50ppm/C
±100ppm/°C
+-50ppm/C
Best Absolute
Tracking TCR
Tracking TCR
(T0303 only)
(T0303 only)
N/A
+-50ppm/C
±50ppm/°C
+-25ppm/C
+-10ppm/C
+-5ppm/C
+-2ppm/C
+-2ppm/C
+-2ppm/C
F G J
FGJ
CDFGJ
21Ω - 50Ω
FGJK
F G J
CDFGJ
CDFGJ
BCDFGJ
BCDFGJ
±50ppm/°C
±25ppm/°C
±10ppm/°C
±5ppm/°C
±2ppm/°C
±2ppm/°C
1.0KΩ - 400KΩ
51Ω - 100Ω
501Ω - 999Ω
0202 and 0303
0202 and 0303
0303 only
CDFGJK
CDFGJK
ABCDFGJ
±100ppm/°C
+-25ppm/C
+-25ppm/C
401KΩ - 800KΩ
101Ω - 200Ω
201Ω - 500Ω
501Ω - 999Ω
CDFGJ
ABCDFGJ
±50ppm/°C
±50ppm/°C
±25ppm/°C
±25ppm/°C
+-25ppm/C
BCDFGJK
BCDFGJK
BCDFGJK
BCDFGJ
BCDFGJ
ABCDFGJ
1.0KΩ - 1.0MΩ
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 3
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
© TT Electronics plc
05.17
Wire Bondable
Chip Resistors
Wire Bondable
Chip Resistors
WBC Series
Environmental Data
Test
Method
MIL-STD-202
Method 107
Test condition F
MIL-STD-883
Method 1008
150°C, 1000 hours
-55°C, 1000 hours
MIL-STD-202
Method 108
70°C, 1000 hours
MIL-STD-202
Method 108
125°C, 1000 hours
Max
R
Typical
R
Thermal Shock
±0.1%
±0.02%
High Temperature Exposure
±0.1%
±0.05%
Low Temperature Storage
±0.03%
±0.01%
Life
±0.5%
±0.01%
Life at Elevated Temperature
±0.5%
±0.05%
Ordering Data
Prefix
WBC
R0202
A
S
01
1002
F
B
Style
R0202 = Discrete Element
B0202 = Discrete Element with Back Contact
1
T0303 = Tapped Network
Bonding pads
Backside
A = Aluminum; G = Gold
1
A = Aluminum; G = Gold; S = Silicon
TCR/Inspection Code
Reference TCR/Inspection Code Table
Total Resistance (R)
4-Digit Resistance Code Ex: 1002 = 10K
Ω
; 50R1 = 50.1
Ω
Absolute Tolerance Code
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (T0303 Only)
J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your
specific requirements, please contact our Applications Team using the contact details below.
Note 1: Not recommended for new designs
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009
Sheet3 of 3
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
© TT Electronics plc
05.17
查看更多>
用stm32f103做了一个舵机驱动板 延时调试有效 运行无效
用stm32f103做了一个舵机驱动板,就是做了一个最小系统,用定时器2 3 4产生pwm控制舵...
晴天依旧 stm32/stm8
实用电容降压电路
将交流市电转换为低压直流的常规方法是采用变压器降压后再整流滤波,当受体积和成本等因素的限制时,最简...
木犯001号 电源技术
6410 wince 屏幕旋转180度
请6410 wince 屏幕旋转180度,非软件旋转,通过驱动硬件旋转。 有没有人做过,请提供思路,...
wzyllgx WindowsCE
Qt学习之路第52篇 使用拖放
拖放(Drag and Drop),通常会简称为 DnD,是现代软件开发中必不可少的一项技术...
兰博 嵌入式系统
触摸技术讨论:如何捕获笔在触摸屏上的快速滑动动作,并提供一个消息给顶层窗口?
当笔在触摸屏上快速滑过时,应用程序想做一些翻页操作。 但现在想在这个动作发生时,有程序或者是系统能捕...
wiln 嵌入式系统
【L99H92直流电机驱动评估板】AEK-MOT-WINH92开发板电路分析
AEK-MOT-WINH92开发板:该电路板设计基于用于汽车应用的L99H92 H桥栅极驱动...
suntongxue 电机驱动控制(Motor Control)
热门器件
热门资源推荐
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
需要登录后才可以下载。
登录取消