White Electronic Designs
32Kx32 EEPROM MODULE, SMD 5962-94614
FEATURES
■
Access Times of 80*, 90, 120, 150ns
■
MIL-STD-883 Compliant Devices Available
■
Packaging:
68 lead, Hermetic CQFP (G2U), 122.4mm
(0.880") square, 3.56mm (0.140") height
(Package 510).
68 lead, Hermetic CQFP (G1U)
1
, 23.9mm
(0.940") square, 3.56mm (0.140") high (Pack
age 519)
68 lead, Hermetic CQFP (G1T), 23.9mm
(0.940") square, 4.06mm (0.160"), (Package
524)
66-pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
WE32K32-XXX
■
Data Retention at 25°C, 10 Years
■
Write Endurance, 10,000 Cycles
■
Organized as 32Kx32; User Configurable 64Kx16
or 128Kx8
■
Commercial, Industrial and Military Temperature
Ranges
■
Automatic Page Write Operation
■
Page Write Cycle Time: 10ms Max
■
Data Polling for End of Write Detection
■
Hardware and Software Data Protection
■
TTL Compatible Inputs and Outputs
■
5 Volt Power Supply
■
Low Power CMOS, 10mA Standby Typical
■
Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
* 80ns speed is not fully characterized and is subject to change or
cancellation without notice.
NOTE 1: Package not recommended for new design
FIG. 1
PIN CONFIGURATION FOR WE32K32N-XH1X
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
NC
NC
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
32K x 8
32K x 8
OE
A
0-14
32K x 8
32K x 8
W E
1
CS
1
P
IN
D
ESCRIPTION
56
I/O
0-31
Data Inputs/Outputs
A
0-14
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
I/O
20
66
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
October 2002 Rev. 3
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WE32K32-XXX
FIG. 2
PIN CONFIGURATION FOR WE32K32-XG2UX, WE32K32-XG1UX
1
,
AND WE32K32-XG1TX
T
OP
V
IEW
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
GND
CS
4
WE
1
A
6
A
7
A
8
A
9
A
10
V
CC
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-14
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
WE
1-4
CS
1-4
OE
V
CC
GND
NC
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
OE
NC
NC
NC
CS
1
CS
2
WE
2
WE
3
B
LOCK
D
IAGRAM
W E
1
CS
1
OE
A
0-14
32K x 8
32K x 8
32K x 8
32K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
8
8
8
WE
4
V
CC
A
11
A
12
A
13
A
14
I/O
0-7
I/O
8-15
I/O
16-23
NC
NC
NC
8
I/O
24-31
Note 1: Package not recommended for new design
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
2
White Electronic Designs
A
BSOLUTE
M
AXIMUM
R
ATINGS
Parameter
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Voltage on OE and A9
Symbol
T
A
T
STG
V
G
-55 to +125
-65 to +150
-0.6 to +6.25
-0.6 to +13.5
Unit
°C
°C
V
V
CS
H
L
L
X
X
X
OE
X
L
H
H
X
L
WE
X
H
L
X
H
X
WE32K32-XXX
T
RUTH
T
ABLE
Mode
Standby
Read
Write
Out Disable
Write
Inhibit
Data I/O
High Z
Data Out
Data In
High Z/Data Out
NOTE:
Stresses above those listed under "Absolute Maximum Ratings"
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any
other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
R
ECOMMENDED
O
PERATING
C
ONDITIONS
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
Symbol
V
CC
V
IH
V
IL
T
A
T
A
Min
4.5
2.0
-0.5
-55
-40
Max
5.5
V
CC
+ 0.3
+0.8
+125
+85
Unit
V
V
V
°C
°C
Parameter
Address Input Capacitance
OE Capacitance
CS
1-4
Capacitance
WE
1-4
Capacitance
Data I/O Capacitance
C
APACITANCE
(T
A
= 25° C)
Symbol
C
AD
C
OE
C
CS
C
WE
C
I/O
Condition
V
IN
= 0V, f = 1.0MHz
V
IN
= 0V, f = 1.0MHz
V
IN
= 0V, f = 1.0MHz
V
IN
= 0V, f = 1.0MHz
Max Unit
50
20
20
20
pF
pF
pF
pF
This parameter is guaranteed by design but not tested.
DC C
HARACTERISTICS
(V
CC
= 5.0V, GND = 0V, T
A
= -55°C
TO
+125°C)
Parameter
Input Leakage Current
Output Leakage Current
Standby Current
Output Low Voltage
Output High Voltage
Symbol
I
LI
Conditions
V
CC
= 5.5, V
IN
= GND to V
CC
Min
-80
Max
10
10
320
2.5
0.45
2.4
2.4
-90
Min Max
10
10
250
2.5
0.45
2.4
-120
Min Max
10
10
200
2.5
0.45
2.4
-150
Min Max
10
10
150
2.5
0.45
Units
µA
µA
mA
mA
V
V
I
LO x 32
CS = V
IH
, OE = V
IH
, V
OUT
= GND to V
CC
I
SB
V
OL
V
OH
CS = V
IH
, OE = V
IH
, f = 5MHz
I
OL
= 2.1mA, V
CC
= 4.5V
I
OH
= -400µA, V
CC
= 4.5V
Operating Supply Current x 32 Mode I
CC x 32
CS = V
IL
, OE = V
IH
, f = 5MHz
NOTE: DC test conditions: V
IH
= V
CC
-0.3V, V
IL
= 0.3V
F
IG
. 3 AC T
EST
C
IRCUIT
Parameter
AC T
EST
C
ONDITIONS
Typ
V
IL
= 0, V
IH
= 3.0
5
1.5
1.5
Unit
V
ns
V
V
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
≈
Output Timing Reference Level
Notes:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z
0
= 75
W.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
3
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
White Electronic Designs
WRITE
A write cycle is initiated when OE is high and a low pulse
is on WE or CS with CS or WE low. The address is
latched on the falling edge of CS or WE whichever oc-
curs last. The data is latched by the rising edge of CS
or WE, whichever occurs first. A byte write operation
will automatically continue to completion.
WE32K32-XXX
eration. Each subsequent WE transition from high to
low that occurs before the completion of the 150 µsec
time out will restart the timer from zero. The operation
of the timer is the same as a retriggerable one-shot.
WRITE CYCLE TIMING
Figures 4 and 5 show the write cycle timing relation-
ships. A write cycle begins with address application,
write enable and chip select. Chip select is accom-
plished by placing the CS line low. Write enable con-
sists of setting the WE line low. The write cycle begins
when the last of either CS or WE goes low.
The WE line transition from high to low also initiates an
internal 150 µsec delay timer to permit page mode op-
AC W
RITE
C
HARACTERISTICS
(V
CC
= 5.0V, GND = 0V, T
A
= -55°C
TO
+125°C)
WRITE CYCLE
Write Cycle Parameter
Write Cycle Time, TYP = 6ms
Address Set-up Time
Write Pulse Width (WE or CS)
Chip Select Set-up Time
Address Hold Time
Data Hold Time
Chip Select Hold Time
Data Set-up Time
Write Pulse Width High
Output Enable Set-up Time
Output Enable Hold Time
Symbol
t
WC
t
AS
t
WP
t
CS
t
AH
t
DH
t
CSH
t
DS
t
WPH
t
OES
t
OEH
0
100
0
50
0
0
50
50
10
10
Min
-80
Max
10
0
100
0
50
0
0
50
50
10
10
Min
-90
Max
10
30
150
0
100
10
0
100
50
10
10
Min
-120
Max
10
30
150
0
100
10
0
100
50
10
10
Min
-150
Max
10
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
4
White Electronic Designs
FIG. 4
WRITE WAVEFORMS WE CONTROLLED
t
WC
OE
t
OES
ADDRESS
CS
1-4
WE
1-4
t
WP
t
DS
DATA IN
t
WPH
t
DH
t
AS
t
CS
t
AH
t
CSH
t
OEH
WE32K32-XXX
FIG. 5
WRITE WAVEFORMS CS CONTROLLED
t
WC
OE
t
OES
ADDRESS
WE
1 - 4
CS
1 - 4
t
WP
t
DS
DATA IN
t
WPH
t
DH
t
AS
t
CS
t
AH
t
CSH
t
OEH
5
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
