Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
厂商名称:White Electronic Designs Corporation
厂商官网:http://www.wedc.com/
下载文档型号 | WEDPN16M64VR-100BM | WEDPN16M64VR-100BC | WEDPN16M64VR-125BM | WEDPN16M64VR-125BI | WEDPN16M64VR-125BC | WEDPN16M64VR-100BI | WEDPN16M64VR-66BI | WEDPN16M64VR-66BM | WEDPN16M64VR-133BC | WEDPN16M64VR-133BI |
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描述 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
包装说明 | 32 X 25 MM, PLASTIC, BGA-219 | BGA, BGA219,16X16,50 | 32 X 25 MM, PLASTIC, BGA-219 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | 32 X 25 MM, PLASTIC, BGA-219 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 6 ns | 6 ns | 5.8 ns | 5.8 ns | 5.8 ns | 6 ns | 7.5 ns | 7.5 ns | 5.4 ns | 5.4 ns |
其他特性 | AUTO REFRESH | AUTO/SELF REFRESH | AUTO REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
备用内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最大时钟频率 (fCLK) | 100 MHz | 100 MHz | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 66 MHz | 66 MHz | 133 MHz | 133 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 |
长度 | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm |
内存密度 | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bi | 1073741824 bi |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 70 °C | 125 °C | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C | 70 °C | 85 °C |
最低工作温度 | -55 °C | - | -55 °C | -40 °C | - | -40 °C | -40 °C | -55 °C | - | -40 °C |
组织 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
座面最大高度 | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm |
最大待机电流 | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A |
最大压摆率 | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm |
自我刷新 | - | YES | - | YES | YES | YES | YES | - | YES | YES |