WEDPNF8M722V-1010BC,WEDPNF8M722V-1010BC pdf中文资料,WEDPNF8M722V-1010BC引脚图,WEDPNF8M722V-1010BC电路-Datasheet-电子工程世界

参数对比

与WEDPNF8M722V-1010BC相近的元器件有：WEDPNF8M722V-1012BM、WEDPNF8M722V-1015BM、WEDPNF8M722V-1010BM、WEDPNF8M722V-XBX、WEDPNF8M722V-1215BM、WEDPNF8M722V-1215BI、WEDPNF8M722V-1212BI、WEDPNF8M722V-1210BC、WEDPNF8M722V-1012BC。描述及对比如下：

型号	WEDPNF8M722V-1010BC	WEDPNF8M722V-1012BM	WEDPNF8M722V-1015BM	WEDPNF8M722V-1010BM	WEDPNF8M722V-XBX	WEDPNF8M722V-1215BM	WEDPNF8M722V-1215BI	WEDPNF8M722V-1212BI	WEDPNF8M722V-1210BC	WEDPNF8M722V-1012BC
描述	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
是否Rohs认证	不符合	不符合	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合
厂商名称	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
包装说明	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	-	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275
Reach Compliance Code	unknow	unknow	unknow	unknow	-	unknow	unknow	unknow	unknow	unknow
其他特性	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	-	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH
JESD-30 代码	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	-	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275
长度	32 mm	32 mm	32 mm	32 mm	-	32 mm	32 mm	32 mm	32 mm	32 mm
内存密度	603979776 bi	603979776 bi	603979776 bi	603979776 bi	-	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	72	72	72	72	-	72	72	72	72	72
功能数量	1	1	1	1	-	1	1	1	1	1
端子数量	275	275	275	275	-	275	275	275	275	275
字数	8388608 words	8388608 words	8388608 words	8388608 words	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
字数代码	8000000	8000000	8000000	8000000	-	8000000	8000000	8000000	8000000	8000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	125 °C	125 °C	125 °C	-	125 °C	85 °C	85 °C	70 °C	70 °C
最低工作温度	-	-55 °C	-55 °C	-55 °C	-	-55 °C	-40 °C	-40 °C	-	-
组织	8MX72	8MX72	8MX72	8MX72	-	8MX72	8MX72	8MX72	8MX72	8MX72
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	-	BGA	BGA	BGA	BGA	BGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	-	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	MILITARY	MILITARY	MILITARY	-	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	-	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	25 mm	25 mm	25 mm	25 mm	-	25 mm	25 mm	25 mm	25 mm	25 mm