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X20C16PM-55

Non-Volatile SRAM, 2KX8, 55ns, CMOS, PDIP28, PLASTIC, DIP-28

器件类别:存储    存储   

厂商名称:Force Technologies Ltd

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器件参数
参数名称
属性值
厂商名称
Force Technologies Ltd
零件包装代码
DIP
包装说明
DIP,
针数
28
Reach Compliance Code
unknown
ECCN代码
3A001.A.2.C
最长访问时间
55 ns
JESD-30 代码
R-PDIP-T28
长度
36.32 mm
内存密度
16384 bit
内存集成电路类型
NON-VOLATILE SRAM
内存宽度
8
功能数量
1
端子数量
28
字数
2048 words
字数代码
2000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
2KX8
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
4.82 mm
表面贴装
NO
技术
CMOS
温度等级
MILITARY
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
15.24 mm
文档预览
SCD#QM5299
Source Control Drawing
Upscreening/Manufacturing Specification P/N FT20C16-45EMB-X
Title Page ................................................................................
List of Effective Pages ..............................................................
Change List ..............................................................................
Definitions .................................................................................
Acronyms and Abbreviations .....................................................
1
2
3
3.1
3.2
3.3
4
4.1
5
5.1
6
6.1
7
8
8.1
8.2
8.3
8.4
Contents.
Introduction/Purpose .................................................................
Reference Documents ...............................................................
Source of Parts.........................................................................
Original Part Manufacturer .........................................................
Screening Company...................................................................
UK Supplier...............................................................................
Manufacturing ...........................................................................
Screening .................................................................................
Certificate of Conformity ............................................................
FT Certificate of Conformity .......................................................
Package Description..................................................................
Marking ....................................................................................
Traceability ...............................................................................
Component selection .................................................................
General ....................................................................................
Nuclear Hardness ......................................................................
Baseline Component .................................................................
Obsolescence notice .................................................................
Date-200603
Date-
Date-
Date-
Date-
Date-
iss-1
iss-
iss-
iss-
iss-
iss-
Rev-
Rev-
Rev-
Rev-
Rev-
Rev-
Changes-Orig
Changes-
Changes-
Changes-
Changes-
Changes-
Name-MLSalmon
Name-
Name-
Name-
Name-
Name-
TM
Force Technologies Ltd
2003
1
INTRODUCTION/PURPOSE
This document specifies the manufacturing, procurement details and screening requirements.
In brief the part is: High Speed NOVRAM
A package description is given in section 6 of this document.
REFERENCE DOCUMENTS
Test Method and procedures for
Microcircuits
General Specs for Hybrids
Sort, incoming and outgoing
Inspection procedures
2
MIL-STD-883
(latest issue)
MIL-PRF-38534
Department of Defence
Washington
DC 20363-5100, USA
3
SOURCE OF PARTS
This section provides an overview of the companies involved in the manufacture, screening and supply of the
part. Original procurement of parts shall be from the address specified in section 3.3.
Original Part Manufacturer
The original part: die are/were produced by : Xicor
Manufacturer:Xicor
Address:
1511 Buckeye Drive
Milpitas
CA95035-9985
The donor part number is: X20C16W
3.1
3.2
Assy /Manu,/Screening Company
The above parts are then assembled and screened by:
Classified Disclosure under NDA or disclosed as:
3.3
UK Supplier
The assembled/screened parts shall be procured from:
Force Technologies Ltd
Tel: +44(0)1264 731200
Fax: +44(0)1264 731444
Ashley Court,
Henley,
Marlborough,
Wilts, UK
SN8 3RH
The Force Technologies part number(Ordering Code) is: FT20C16-45EMB-X
QM5299
4.0
Manufacture
(Manufacturing processes, assembly, Screen and test equipment listings available for inspection upon request.
Part Number breakdown
FT20C16EMB-45-X
E
=
32LCC
MB
=
Mil-Std-883
X
=
Xicor
45
=
45ns
=
4.1
SCREENING
The FT20C16-45EMB-X shall be screened as specified in the table below.
All batches of parts shall be supplied with a Certificate of Conformity. The certificate of conformity shall reference the
screening specified below.
Screening
Visual Inspection
Internal Visual (Pre-Cap)
Destructive tests
Temperature cycling
Constant acceleration
Seal
a. Fine
b. Gross
Visual inspection
Interim Electrical
Burn-in test
Percentage defective
allowable (PDA)
Final electrical test
Final electrical test
A) Static Tests 5005
1)Subgroups 1(25oC) 2(+125oC0) 3(-55oC)
B) Dynamic Test or Switching Test
1) Subgroup 4 or 9 (25oC)
C)Functional Test
1) Subgroup 7(25oC) 8a(+125oC) 8b(-55oC)
External Visual
Radiation latch-up
Group B
Group C
Group D
Method
Incoming and Outgoing
Inspection Procedures
2010 Cond B (applicable to packaging parts)
1010, test condition C
2001, test condition E (min)
Y1 orientation only
1014
A1
C1
Sub group 1&7
1015, 160 hours at 125
°
C minimum
5 percent
QCI group A
Group A all subgroups
Default procedure
Parameters In accordance with applicable
device specification.
Req.t
100%
100%
Optional
100%
100%
100%
Note
1
100%
100%
100%
All lots
100%
100%
2
3
3
2009
1020
5005
5005
5005
100%
Optional
Optional
Optional
Optional
Notes:
1/ For Pre-assembled product
2/ Manufactured batches shall have Lots tests carried out in accordance with Mil-Std-883
3/ Part No.
X20C16EMB45
Data sheet included on .PDF copy
Manufacturing
Die visual
Die attach JM7000 & Cure
Die shear
Visual Inspection
Wire Bond
Wire Bond Strength
Visual
Preseal Visual
Preseal Vacuum
Seal Solder seal in belt furnace under Nitrogen
2010 cond B 100%
2019.5 100%
2019.5
2010.1
.00125 Alum
2023.5
2010.1
2010.1 mil std 883 100%
1 hour min 150oC under Vacuum
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