Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240
厂商名称:XILINX(赛灵思)
厂商官网:https://www.xilinx.com/
下载文档型号 | XC4062XLTHQ240 | XC4062XLTBGG432 | XC4062XLTBG432 | XC4028XLTHQ240 |
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描述 | Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 | Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PBGA432, CAVITY DOWN, PLASTIC, BGA-432 | Field Programmable Gate Array, 2304 CLBs, 40000 Gates, CMOS, PBGA432, CAVITY DOWN, PLASTIC, BGA-432 | Field Programmable Gate Array, 1024 CLBs, 18000 Gates, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 |
零件包装代码 | QFP | BGA | BGA | QFP |
包装说明 | HFQFP, | CAVITY DOWN, PLASTIC, BGA-432 | CAVITY DOWN, PLASTIC, BGA-432 | HEAT SINK, PLASTIC, QFP-240 |
针数 | 240 | 432 | 432 | 240 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
JESD-30 代码 | S-PQFP-G240 | S-PBGA-B432 | S-PBGA-B432 | S-PQFP-G240 |
JESD-609代码 | e0 | e1 | e0 | e0 |
长度 | 32 mm | 40 mm | 40 mm | 32 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 |
可配置逻辑块数量 | 2304 | 2304 | 2304 | 1024 |
等效关口数量 | 40000 | 40000 | 40000 | 18000 |
端子数量 | 240 | 432 | 432 | 240 |
组织 | 2304 CLBS, 40000 GATES | 2304 CLBS, 40000 GATES | 2304 CLBS, 40000 GATES | 1024 CLBS, 18000 GATES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HFQFP | LBGA | LBGA | HFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, HEAT SINK/SLUG, FINE PITCH |
峰值回流温度(摄氏度) | 225 | 260 | 225 | 225 |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.1 mm | 1.7 mm | 1.7 mm | 4.1 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
端子面层 | TIN LEAD | TIN SILVER COPPER | TIN LEAD | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | BALL | BALL | GULL WING |
端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm |
端子位置 | QUAD | BOTTOM | BOTTOM | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
宽度 | 32 mm | 40 mm | 40 mm | 32 mm |
厂商名称 | - | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |