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XPC823VF81B2

32-BIT, 81MHz, RISC PROCESSOR, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA-256

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
Motorola ( NXP )
零件包装代码
BGA
包装说明
BGA, BGA256,16X16,40
针数
256
Reach Compliance Code
unknown
地址总线宽度
32
位大小
32
边界扫描
YES
外部数据总线宽度
32
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B256
长度
17 mm
低功率模式
YES
端子数量
256
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA256,16X16,40
封装形状
SQUARE
封装形式
GRID ARRAY
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.75 mm
速度
81 MHz
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
17 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
文档预览
Order this document by
MPC823ELE/D
Revision 1
MPC823 AC Electrical Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for the MPC823.
Note:
Visit our website at www.motorola.com if you are using a frequency other than
25, 40, or 50MHz. Our website contains a spreadsheet that you can use to
calculate the timing for your specific system frequency.
This device contains circuitry protecting against damage from high-static voltage or electrical
fields. However, it is advised that precautions be taken to avoid application of any voltages
higher than the maximum-rated voltages to this high-impedance circuit. Reliability of operation
is enhanced if unused inputs are tied to an appropriate logic voltage level (either GND or V
CC
).
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. PowerPC
is a registered trademark of IBM Corp. and is used by Motorola under license from IBM Corp. I
2
C is a registered trademark of Philips Corporation.
Ó
2000 Motorola, Inc.All Rights Reserved.
MAXIMUM RATINGS (GND = 0V)
RATING
Supply Voltage
SYMBOL
VDDH
VDD
KAPWR
VDDSYN
Input Voltage (JTAG and GPIO)
Input Voltage (All other pins)
Operating Temperature
VIN
VIN
T
A
VALUE
-0.3 to 4.0
-0.3 to 4.0
-0.3 to 4.0
-0.3 to 4.0
-0.3 to 5.8
-0.3 to 3.3
0 to 70û
or
-40û to 85û
-55 to +150
UNIT
V
V
V
V
V
V
ûC
Storage Temperature Range
NOTES:
1.
T
STG
ûC
Functional operating conditions are given in
DC Electrical Characteristics (VCC = 3.0 - 3.6
V)
. Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond those listed may affect device reliability or cause
permanent damage to the device.
CAUTION
: The JTAG and GPIO input voltages cannot be more than 2.5 V greater than
supply voltage, this restriction applies also on Òpower-onÓ as well as on normal operation.
5 Volt friendly inputs are inputs that tolerate 5 volts for JTAG and GPIO pins.
If you are using Mask Revision Base #F98S (Revision 0), all pins except EXTAL and CLK4IN
are 5V tolerant inputs.
2.
3.
4.
THERMAL CHARACTERISTICS
CHARACTERISTIC
Thermal Resistance for BGA
SYMBOL
q
Jc
VALUE
~30
UNIT
°
C/W
2
MPC823 ELECTRICAL SPECIFICATIONS
MOTOROLA
POWER CONSIDERATIONS
The average chip-junction temperature
,
T
J
,
in
°
C can be obtained from
T
J
= T
A
+ (P
D
¥
q
JA
)
where
T
A
=
q
JA
=
P
D
=
P
INT
=
P
I/O
=
Ambient Temperature
,
¥
C
Package Thermal Resistance
,
Junction to Ambient
,
¥
C/W
P
INT
+ P
I/O
I
DD
x V
DD
,
WattsÑChip Internal Power
Power Dissipation on Input and Output PinsÑUser Determined
(1)
For most applications P
I/O
< 0.3
¥
P
INT
and can be neglected. If P
I/O
is neglected
,
an approximate
relationship between P
D
and T
J
is:
P
D
=
K
Õ
(T
J
+ 273
¥
C)
(2)
Solving equations (1) and (2) for K gives
K=
P
D
¥
(T
A
+ 273
¥
C) + q
JA
¥ P
D
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
D
(at equilibrium) for a known T
A
. Using this value of K
,
the values of P
D
and T
J
can be obtained by solving equations (1) and (2) iteratively for any value of T
A
.
Layout Practices
Each V
CC
pin on the MPC823 should be provided with a low-impedance path to the boardÕs
supply. Each GND pin should be provided with a low-impedance path to ground. The power
supply pins drive distinct groups of logic on chip. The V
CC
power supply should be bypassed to
ground using at least four 0.1
m
F bypass capacitors located as close as possible to the four
sides of the package. The capacitor leads and associated printed circuit traces connecting to
chip V
CC
and GND should be kept to less than half an inch per capacitor lead. A four-layer
board that employs two inner layers as V
CC
and GND planes should be used.
All output pins on the MPC823 have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections
caused by these fast output switching times. This recommendation particularly applies to the
address and data busses. Maximum PC trace lengths of six inches are recommended.
Capacitance calculations should consider all device loads as well as parasitic capacitances
due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical
in systems with higher capacitive loads because these loads create higher transient currents
in the V
CC
and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins.
MOTOROLA
MPC823 ELECTRICAL SPECIFICATIONS
3
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 3.0 - 3.6 V)
CHARACTERISTIC
Input High Voltage (for JTAG and GPIO)
Input High Voltage (all other pins)
Input Low Voltage
EXTAL and EXTCLK Input High Voltage
Input Leakage Current, V
IN
= 5.5 V
Hi-z (Off State) Leakage Current, V
IN
= 3.5V
Signal Low Input Current, V
IL
= 0.8 V
Signal High Input Current, V
IH
= 2.0 V
Output High Voltage, I
OH
= Ð2.0 mA
,
V
DDH
= 3.0V
Except XTAL, XFC, and Open-Drain Pins
Output Low Voltage
IOL = 2.0 mA CLKOUT
IOL = 3.2 mAA[6:31], TSIZ0/REG, TSIZ1, D(0:31), DP[0:3]/IRQ[3:6],
RD/WR, BURST, RSV/IRQ2, IP_B[0:1]/IWP[0:1]/VFLS[0:1], IP_B2/
IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/
VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3, USBRXD/PA15, RXD2/
PA13, SMRXD2/L1TXDA/PA9, SMTXD2/L1RXDA/PA8, IRQ4/KR/
SPKROUT, TIN1/L1RCLKA/BRGO1/CLK1/PA7, TIN3/TOUT1/
CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5, TIN4/TOUT2/CLK4/
PA4, LCD_A/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29,
BRGO3/SPIMISO/PB28, BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/
PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/PB23,
SMSYN2/SDACK2/PB22, LCD_B/L1ST1/PB19, L1ST2/RTS2/
PB18, LCD_C/L1ST3/PB17, L1ST4/L1RQA/PB16, L1ST5/DREQ1/
PC15, L1ST6/RTS2/DREQ2/PC14, L1ST7/PC13, L1ST8/L1RQA/
PC12, USBRXP/PC11, USBRXN/TGATE1/PC10, CTS2/PC9,
TGATE1/CD2/PC8, USBTXP/PC7, USBTXN/PC6, SDACK1/
L1TSYNCA/PC5, L1RSYNCA/PC4, LD8/VD7/PD15, LD7/VD6/
PD14, LD6/VD5/PD13, LD5/VD4/PD12, LD4/VD3/PD11, LD3/VD2/
PD10, LD2/VD1/PD9, LD1/VD0/PD8, FRAME/VSYNC/PD5,
LCD_AC/LOE/BLANK/PD6, LD0/FIELD/PD7, LOAD/HSYNC/PD4,
SHIFT/CLK/PD3
IOL = 5.3 mABDIP/GPL_B5, BR, BG, FRZ/IRQ6, CS[0:5], CS6/
CE1_B, CS7/CE2_B, WE0/BS_AB0/IORD, WE1/BS_AB1/IOWR,
WE2/BS_AB2/PCOE, WE3/BS_AB3/PCWE, GPL_A0/GPL_B0, OE/
GPL_A1/GPL_B1, GPL_A[2:3]/GPL_B[2:3]/CS[2:3], UPWAITA/
GPL_A4/AS, UPWAITB/GPL_B4, GPL_A5, ALE_B/DSCK/AT1,
OP2/MODCK1/STS, OP3/MODCK2/DSDO
IOL = 7.0 mA USBOE/PA14, TXD2/PA12
IOL = 8.9 mATS, TA, TEA, BI, BB, HRESET, SRESET
NOTE: Input pin voltage specifications are V
CC
= +4 V or 5.8 V, whichever is less.
AC timings are based on a 50 p
¦
load.
If you are using Mask Revision Base #F98S, all pins except EXTAL and CLK4IN are 5V tolerant inputs.
SYMBOL
V
IH
V
IH
V
IL
V
IHC
I
IN
I
OZ
I
L
I
H
V
OH
V
OL
2.4
Ñ
MIN
2.0
2.0
GND
0.7*(V
CC
)
Ñ
Ñ
MAX
5.5
3.6
0.8
V
CC
+0.3
±10
±10
±10
±10
Ñ
0.5
UNIT
V
V
V
V
µA
µA
µA
µA
V
V
4
MPC823 ELECTRICAL SPECIFICATIONS
MOTOROLA
AC ELECTRICAL CHARACTERISTICS
2.0V
CLKOUT
0.8V
A
B
2.0V
OUTPUTS
0.8V
2.0V
0.8V
0.8V
2.0V
A
B
2.0V
OUTPUTS
0.8V
2.0V
0.8V
C
D
2.0V
INPUTS
0.8V
2.0V
0.8V
C
2.0V
INPUTS
0.8V
D
2.0V
0.8V
A = MAXIMUM OUTPUT DELAY SPECIFICATION
B = MINIMUM OUTPUT HOLD TIME
C = MINIMUM INPUT SETUP TIME SPECIFICATION
D = MINIMUM INPUT HOLD TIME SPECIFICATION
MOTOROLA
MPC823 ELECTRICAL SPECIFICATIONS
5
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参数对比
与XPC823VF81B2相近的元器件有:XPC823ZT81B2T、XPC823CZT66B2、XPC823VF75B2、XPC823ZT66B2T、XPC823CVF66B2、XPC823ZT75B2T。描述及对比如下:
型号 XPC823VF81B2 XPC823ZT81B2T XPC823CZT66B2 XPC823VF75B2 XPC823ZT66B2T XPC823CVF66B2 XPC823ZT75B2T
描述 32-BIT, 81MHz, RISC PROCESSOR, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA-256 32-BIT, 81MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 RISC Microprocessor, 32-Bit, 75MHz, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA-256 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA-256 32-BIT, 75MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
包装说明 BGA, BGA256,16X16,40 BGA, BGA, BGA256,16X16,50 BGA, BGA256,16X16,40 BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA-256 BGA,
Reach Compliance Code unknown unknown unknown unknown unknown unknow unknow
地址总线宽度 32 32 32 32 32 32 32
位大小 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES
外部数据总线宽度 32 32 32 32 32 32 32
格式 FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES YES YES YES YES YES
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
长度 17 mm 23 mm 23 mm 17 mm 23 mm 17 mm 23 mm
低功率模式 YES YES YES YES YES YES YES
端子数量 256 256 256 256 256 256 256
最高工作温度 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 2.35 mm 2.35 mm 1.75 mm 2.35 mm 1.75 mm 2.35 mm
速度 81 MHz 81 MHz 66 MHz 75 MHz 66 MHz 66 MHz 75 MHz
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1.27 mm 1.27 mm 1 mm 1.27 mm 1 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 17 mm 23 mm 23 mm 17 mm 23 mm 17 mm 23 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
零件包装代码 BGA BGA - - BGA - BGA
针数 256 256 - - 256 - 256
封装等效代码 BGA256,16X16,40 - BGA256,16X16,50 BGA256,16X16,40 - BGA256,16X16,40 -
电源 3.3 V - 3.3 V 3.3 V - 3.3 V -
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