SFP
Vishay Electro-Films
CHIP
RESISTORS
Thin Film Top-Contact Resistor
with Part Mark
FEATURES
•
Wire bondable
Product may not
be to scale
•
Part marked - 5 digits
•
Small size: 0.022 inches square
•
Resistance range: 1
Ω
to 1 MΩ
•
DC power rating: 250 mW
•
Oxidized silicon substrate for good power dissipation
•
Resistor material: Tantalum nitride, self passivating
•
Moisture resistant
The SFP series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFPs are part marked with resistance value allowing
user the ability to visually determine the resistance value of
the chip.
The SFPs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology.
The SFPs are 100 % electrically tested and visually
inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is
important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of
the chip.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1%
0.5 %
PROCESS CODE
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
CLASS H*
103
102
101
100
CLASS K*
108
107
106
105
1
Ω
10
Ω
30
Ω
100
Ω
200 k
Ω
430 k
Ω
620 k
Ω
1 M
Ω
* MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Values above 1M available
www.vishay.com
40
For technical questions, contact: ff2bresistors@vishay.com
Document Number: 61000
Revision: 07-Mar-08
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
250 mW
± 0.25 % max.
ΔR/R
SFP
Thin Film Top-Contact Resistor
with Part Mark
DIMENSIONS
in inches
Vishay Electro-Films
CHIP
RESISTORS
0.005
PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
0.018
0.022
TYPICAL RANGE
< 30
Ω
TYPICAL RANGE
30
Ω
- 199
Ω
TYPICAL RANGE
200
Ω
- 1 kΩ
TYPICAL RANGE
1 kΩ - 1 MΩ
0.004
SCHEMATIC
STANDARD MARKING - 5 DIGITS
XXXX
X
Four significant digits of value
Multiplier
C = 0.001
B = 0.01
A = 0.1
0=0
1 = 10
2 = 100
3 = 1000
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
Gold backing for eutectic die attach
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
0.022 x 0.022 ± 0.003 (0.558 x 0.558 ± 0.05 mm)
0.010 ± 0.002 (0.254 ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.004 x 0.004 (0.10 x 0.10 mm)
2
25 kÅ minimum aluminum
None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 10 k
Ω
, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION
/PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial
visually inspected parts loaded in
matrix trays (4 % AQL)
SFP
PRODUCT
FAMILY
100
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits
of the resistance
1
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
*Coating standard
Document Number: 61000
Revision: 07-Mar-08
For technical questions, contact: ff2bresistors@vishay.com
www.vishay.com
41
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
嵌入式系统
