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Express-HLE

COM Express

Basic Size Type 6 Module with

Intel

Core™ and Celeron

Processor with ECC

Features

●

Intel

Core™ i7/i5/i3 Processor with Mobile Intel

QM87 Express

Chipset

Up to 16GB Dual Channel ECC DDR3L at 1600MHz

Three DDI ports support 3 independent displays

Seven PCIe x1, one PCIe x16

GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0

Supports Smart Embedded Management Agent (SEMA

) functions

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

●

Specifications

●

Core System

CPU

4th Generation Intel

Core™ i7 Processors (Mobile) - 22nm

i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2)

i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2)

i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2)

i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2)

i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2)

i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3)

Celeron

2000E 2.2 GHz (no Turbo) 35W (2C/GT1)

Celeron

2002E 1.5 GHz (no Turbo) 25W (2C/GT1)

Supports: Intel

VT, Intel

TXT, Intel

SSE4.2, Intel

HT Technology, Intel

Architecture, Execute Disable Bit, Intel

Turbo Boost Technology 2.0, Intel

AVX2, Intel

AES-NI, PCLMULQDQ Instruction, Intel

Secure Key and Intel

TSX.

Note: Availability of the features may vary between processor SKUs.

●

Video

GPU Feature Support

Generation 7.5 graphics core architecture, supporting

3 independent and simultaneous display combinations of DisplayPort /HDMI

/ LVDS monitors

Encode/transcode HD content

Digital Display Interface

DDI1 supporting DisplayPort / HDMI / DVI

DDI2 supporting DisplayPort / HDMI / DVI

DDI3 supporting DisplayPort / HDMI / DVI

VGA

Analog VGA support with 300 MHz DAC

Analog monitor support up to QXGA (2048 x 1536)

Memory

Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual

SODIMM socket

LVDS

Single/dual channel 18/24-bit LVDS from eDP (two lanes)

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 9.0 support

●

Audio

Chipset

Intel

HD Audio integrated in SOC

L3 Cache

6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E

Audio Codec

Located on carrier Express-BASE6 (ALC886 standard supported)

Expansion Busses

PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4)

6 PCI Express x1 (AB): lanes 0/1/2/3/4/5

1 PCI Express x1 (CD): lane 6

LPC bus, SMBus (system) , I

C (user)

Supports: Voltage/Current monitoring, Power sequence debug support, AT/

ATX mode control, Logistics and Forensic information, Flat Panel Control,

General Purpose I

C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan

Control

●

Ethernet

Intel

MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support

Interface: 10/100/1000 GbE connection

SEMA Board Controller

●

I/O Interfaces

USB: 4x USB 3.0 (USB 0,1,2,3)

4x USB 2.0 (USB 4,5,6,7)

SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)

Serial: 2 UART ports COM1/2 with console redirection

GPIO: 4 GPO and 4 GPI with interrupt

Debug Headers

40-pin multipurpose flat cable connector

Use in combination with DB-40 debug module

Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power

Testpoints, Debug LEDs

60-pin XDP header for ICE debug of CPU/chipset

Note:

“build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

●

Super I/O

Standard support for W83627DHG-P

Supported on carrier if needed

●

Mechanical and Environmental

Form Factor: PICMG COM.0: Rev 2.1 Type 6

Dimension: Basic size: 125 mm x 95 mm

●

TPM

Chipset: Atmel AT97SC3204

Type: TPM 1.2

Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged: -40°C to +85°C (build option)

●

Power

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V ±5%

Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V

Management: ACPI 4.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4,

WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT Tested

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

●

Operating Systems

Standard Support

Windows 7/8 32/64-bit, Linux 32/64-bit

Extended Support (BSP)

WES7/8, Linux , VxWorks, QNX

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.

Functional Diagram

SODIMM ECC

1333/1600 MHz

1~8 GB DDR3L

SODIMM ECC

1333/1600 MHz

1~8 GB DDR3L

single / dual

18/24-bit LVDS

Generation

Intel® Core

i7/i5/i3 Processor

eDP

2 lane

60-pin

XDP

D D I 1 (port B )

D P / H D MI / D V I / S D V O

DDI 2 (port C)

DP / HDMI / DVI

DDI 3 (port D)

DP / HDMI / DVI

PCI Express x16 (Gen3)

2 x8 or 1 x8 + 2 x4

RTD2136R/N

eDP-LVDS

Intel® Celeron®

“Haswell”

6x PCIe x1 (Gen2)

(port 0~5)

i217LM

GbE

4x USB 3.0 upgrade (QM87)

2x USB 3.0 upgrade (HM86)

PCIe x1

(port 7)

4x SATA3 (QM87)

2x SATA3 & 2x SATA2 (HM86)

8x USB 1.1/2.0

HD Audio

Mobile Intel®

QM87/HM86

Chipset

1x PCIe x1 (Gen2)

(port 6)

UART0

UART1

Debug

header

NCT5104D

Serial

ATMEL

AT97SC3204

TPM

LPC bus

PCA9535

4x GP0

4x GPI

SMBus

GPIO

SPI 0

BIOS

SPI_CS0

SPI_CS1

GP I C

DDC I

SPI_CS#

SPI 1

BIOS

Sensor

-40+85°C

SEMA

SPI

VGA

DMI

FDI

Ordering Information

●

Accessories

Heat Spreaders

●

Express-HLE-i7-4860EQ

COM Express