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IM231L6S1BAUMA1

多相 电机驱动器 IGBT - 23-SOP

产品类别:半导体    多通道IC(PMIC)   

制造商:Infineon(英飞凌)

官网地址:http://www.infineon.com/

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IM231L6S1BAUMA1概述
Infineon IM231-L6 系列 3 相智能电源模块 (IPM) 设计用于高效设备电动机驱动器,如空调风扇和冰箱压缩机。这些 Advanced IPM 提供表面安装和通孔配置,提供低 VCE (sat) TRENCHSTOPTM IGBT6 技术和行业基准坚固半桥驱动器的组合。

温度监控器
精确的过电流关闭 (±5%)
故障报告和可编程故障清除
Advanced 输入滤波器,带直通保护
IM231L6S1BAUMA1规格参数
参数名称
属性值
类别
半导体;多通道IC(PMIC)
厂商名称
Infineon(英飞凌)
系列
CIPOS™ IPM
包装
卷带(TR)剪切带(CT)
电机类型 - 步进
多相
功能
驱动器
输出配置
半桥(3)
技术
IGBT
应用
风扇电机驱动器
电流 - 输出
6A
电压 - 供电
13.5V ~ 16.5V
电压 - 负载
450V
工作温度
-40°C ~ 150°C(TJ)
安装类型
表面贴装型
封装/外壳
32-PowerSMD 模块,23 条引线
供应商器件封装
23-SOP
基本产品编号
IM231L6
IM231L6S1BAUMA1文档预览
IM231-L6S1B / IM231-L6T2B
Confidential
CIPOS™ Micro IPM 600V/6A
IM231-L6S1B / IM231-L6T2B
Description
IM231-L6-series 3-phase Intelligent Power Modules (IPM) are designed for high-efficiency appliance motor drives
such as air-conditioner fans and refrigerator compressors. These advanced IPMs, available in both surface
mount and through-hole configurations, offer a combination of low V
CE(sat)
TRENCHSTOP
TM
IGBT6 technology and
the industry benchmark rugged half-bridge drivers. The IPMs have several protection features including precise
overcurrent protection and temperature feedback.
Features
600V 3-phase inverter including gate drivers &
bootstrap function
Low V
CE(sat)
TRENCHSTOP™ IGBT6
Temperature monitor
Accurate overcurrent shutdown (±5%)
Fault reporting and programmable fault clear
Advanced input filter with shoot-through
protection
Optimized dV/dt for loss and EMI trade offs
Open-emitter for single and leg-shunt current
sensing
3.3V logic compatible
Isolation 2000VRMS, 1min
SOP 29x12
DIP 29x12
Potential Applications
Air-conditioner fans
Refrigerator compressors
Ventilation fans & blower fans
Low power motor drives
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.
Table 1
Part Ordering Table
Standard Pack
Form
Tube
Tube
Tape & Reel
Quantity
240
240
500
Orderable Part Number
IM231L6T2BAKMA1
IM231L6S1BALMA1
IM231L6S1BAUMA1
Revision 2.1
2019-07-15
Base Part Number Package Type
IM231-L6T2B
IM231-L6S1B
IM231-L6S1B
Final Datasheet
DIP 29x12
SOP 29x12
SOP 29x12
Please read the Important Notice and Warnings at the end of this document
www.infineon.com
CIPOS™ Micro
IM231-L6S1B / IM231-L6T2B
Table of contents
Table of contents
Description 1
Features
1
Potential Applications ..................................................................................................................... 1
Product validation .......................................................................................................................... 1
Table of contents ............................................................................................................................ 2
1
2
2.1
2.2
3
3.1
3.2
3.3
4
5
6
6.1
6.2
7
7.1
7.2
8
9
10
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
13
13.1
13.2
14
Internal Electrical Schematic .......................................................................................... 3
Pin Configuration........................................................................................................... 4
Pin Assignment ........................................................................................................................................ 4
Pin Descriptions....................................................................................................................................... 5
Absolute Maximum Rating .............................................................................................. 7
Module ..................................................................................................................................................... 7
Inverter .................................................................................................................................................... 7
Control ..................................................................................................................................................... 7
Thermal Characteristics ................................................................................................. 8
Recommended Operating Conditions ............................................................................... 9
Static Parameters ......................................................................................................... 10
Inverter .................................................................................................................................................. 10
Control ................................................................................................................................................... 10
Dynamic Parameters ..................................................................................................... 12
Inverter .................................................................................................................................................. 12
Control ................................................................................................................................................... 12
Thermistor Characteristics ............................................................................................ 13
Mechanical Characteristics and Ratings........................................................................... 14
Qualification Information .............................................................................................. 15
Diagrams & Tables ........................................................................................................ 16
T
C
Measurement Point ........................................................................................................................... 16
Backside Curvature Measurement Points ............................................................................................ 16
Input-Output Logic Table ...................................................................................................................... 17
Switching Time Definitions ................................................................................................................... 18
Application Guide ......................................................................................................... 19
Typical Application Schematic ............................................................................................................. 19
T
J
vs T
TH
.................................................................................................................................................. 19
–V
S
Immunity ......................................................................................................................................... 20
Package Outline ........................................................................................................... 21
DIP 29x12 ............................................................................................................................................... 21
SOP 29x12 .............................................................................................................................................. 22
Revision History ........................................................................................................... 23
Final Datasheet
2
Revision 2.1
2019-07-15
CIPOS™ Micro
IM231-L6S1B / IM231-L6T2B
Internal Electrical Schematic
1
Internal Electrical Schematic
1 COM
2 V
B1
3 V
CC1
4 HIN1
5 LIN1
Half-Bridge
HVIC
17 V+
18 U/V
S1
6 RFE
7 V
B2
8 V
CC2
9 HIN2
10 LIN2
Half-Bridge
HVIC
19 V
R1
20 V
R2
21 V/V
S2
11 VTH
12 V
B3
13 V
CC3
14 HIN3
15 LIN3
Half-Bridge
HVIC
22 V
R3
23 W/V
S3
16 ITRIP
Figure 1
Internal electrical schematic.
Final Datasheet
3
Revision 2.1
2019-07-15
CIPOS™ Micro
IM231-L6S1B / IM231-L6T2B
Pin Configuration
2
2.1
Pin Configuration
Pin Assignment
10
12
14
16
6
2
3
1
e
4
5
18
8
7
9
11
13
15
19
20
21
22
23
17
Figure 2
Table 2
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Final Datasheet
Module pinout
Pin Assignment
Name
COM
V
B1
V
DD1
HIN1
LIN1
RFE
V
B2
V
DD2
HIN2
LIN2
VTH
V
B3
V
DD3
HIN3
LIN3
ITRIP
V+
U/V
S1
V
R1
V
R2
V/V
S2
V
R3
W/V
S3
Description
Logic ground
High side floating supply voltage 1
Low side control supply 1
Logic Input for high side gate driver - Phase 1
Logic Input for low side gate driver - Phase 1
RCIN / Fault / Enable
High side floating supply voltage 2
Low side control supply 2
Logic input for high side gate driver - Phase 2
Logic input for low side gate driver - Phase 2
Thermistor output
High side floating supply voltage 3
Low side control supply 3
Logic Input for high side gate driver - Phase 3
Logic Input for low side gate driver - Phase 3
Current protection pin
Dc bus voltage positive
Output - phase 1, high side floating supply offset 1
Phase 1 low side emitter
Phase 2 low side emitter
Output - phase 2, high side floating supply offset 2
Phase 3 low side emitter
Output – phase 3, high side floating suppyl offset 3
4
Revision 2.1
2019-07-15
CIPOS™ Micro
IM231-L6S1B / IM231-L6T2B
Pin Configuration
2.2
Pin Descriptions
The IC shuts down all the gate drivers power
outputs, when the V
DD
supply voltage is below V
DDUV-
= 10.9V. This prevents the external power switches
from critically low gate voltage levels during on-
state and therefore from excessive power
dissipation.
V
B(1,2,3)
and V
S(1,2,3)
(High side supplies)
V
B
to V
S
is the high side supply voltage. The high side
circuit can float with respect to COM following the
external high side power device emitter voltage.
Due to the low power consumption, the floating
driver stage is supplied by integrated bootstrap
circuit.
The under-voltage detection operates with a rising
supply threshold of typical V
BSUV+
= 11.1V and a falling
threshold of V
BSUV-
= 10.9V.
V
S(1,2,3)
provide a high robustness against negative
voltage in respect of COM. This ensures very stable
designs even under rough conditions.
V
R(1,2,3)
(Low side emitters)
t
FILIN
HIN(1,2,3) and LIN(1,2,3) (Low side and high side
control pins)
These pins are positive logic and they are
responsible for the control of the integrated IGBT.
The Schmitt-trigger input thresholds of them are
such to guarantee LSTTL and CMOS compatibility
down to 3.3V controller outputs. Pull-down resistor
of about 800k is internally provided to pre-bias
inputs during supply start-up and an ESD diode is
provided for pin protection purposes. Input
Schmitt-trigger and noise filter provide beneficial
noise rejection to short input pulses.
The noise filter suppresses control pulses which are
below the filter time
T
FILIN
. The filter acts according
to Figure 4.
CIPOS
TM
Schmitt-Trigger
HINx
LINx
COM
0.8
M
INPUT NOISE
FILTER
SWITCH LEVEL
V
IH
; V
IL
Figure 3
a)
HIN
LIN
HO
LO
Input pin structure
t
FILIN
b)
HIN
LIN
high
low
HO
LO
The low side emitters are available for current
measurements of each phase leg. It is
recommended to keep the connection to pin COM as
short as possible in order to avoid unnecessary
inductive voltage drops.
VTH (Thermistor output)
A UL certified NTC resistor is integrated in the
module with one terminal of the chip connected to
COM and the other to VTH. When pulled up to a rail
voltage such as V
DD
or 3.3V by a resistor, the VTH pin
provides an analog voltage signal corresponding to
the temperature of the thermistor.
RFE (RCIN / Fault / Enable)
The RFE pin combines 3 functions in one pin: RCIN or
RC-network based programmable fault clear timer,
fault output and enable input.
The RFE pin is normally connected to an RC network
on the PCB per the schematic in Figure 5. Under
normal operating conditions, R
RCIN
pulls the RFE pin
to 3.3V, thus enabling all the functions in the IPM.
The microcontroller can pull this pin low to disable
the IPM functionality. This is is the Enable function.
5
Revision 2.1
2019-07-15
Figure 4
Input filter timing diagram
The integrated gate drive provides additionally a
shoot through prevention capability which avoids
the simultaneous on-state of the high-side and low-
side switch of the same inverter phase. A minimum
deadtime insertion of typically 300ns is also
provided by driver IC, in order to reduce cross-
conduction of the external power switches.
V
DD
, COM (Low side control supply and reference)
V
DD
is the control supply and it provides power both
to input logic and to the output power stage. Input
logic is referenced to COM ground.
The under-voltage circuit enables the device to
operate at power on when a supply voltage of at
least a typical voltage of V
DDUV+
= 11.1V is present.
Final Datasheet
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