型号
- 型号
- 关键词
| 型号 | 54AC352FM | 54AC352LM | 54AC352DM |
|---|---|---|---|
| 描述 | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,FP,16PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,DIP,16PIN,CERAMIC |
| 包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | unknown | unknown |
| JESD-30 代码 | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A |
| 功能数量 | 2 | 2 | 2 |
| 输入次数 | 4 | 4 | 4 |
| 端子数量 | 16 | 20 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | QCCN | DIP |
| 封装等效代码 | FL16,.3 | LCC20,.35SQ | DIP16,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 |