型号 | 54AC352LM | 54AC352FM | 54AC352DM |
---|---|---|---|
描述 | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,FP,16PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,AC-CMOS,DIP,16PIN,CERAMIC |
包装说明 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknow | unknown |
JESD-30 代码 | S-XQCC-N20 | R-XDFP-F16 | R-XDIP-T16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A |
功能数量 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 |
端子数量 | 20 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
封装代码 | QCCN | DFP | DIP |
封装等效代码 | LCC20,.35SQ | FL16,.3 | DIP16,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | FLATPACK | IN-LINE |
电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 |