型号
- 型号
- 关键词
| 型号 | 5962-8751404XX | 5962-8751404ZX | 5962-8751405ZX | 5962-8751405YX | 5962-8751405XX | 5962-8751404YX | X28C64J-20T3 |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 8KX8, 200ns, Parallel, CMOS, CDIP28, | EEPROM, 8KX8, 200ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDIP28, | EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 8KX8, 200ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 200 ns | 200 ns | 250 ns | 250 ns | 250 ns | 200 ns | 200 ns |
| JESD-30 代码 | R-GDIP-T28 | R-CDFP-F28 | R-CDFP-F28 | R-CQCC-N32 | R-GDIP-T28 | R-CQCC-N32 | R-PQCC-J32 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 32 | 28 | 32 | 32 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIP | DFP | DFP | QCCN | DIP | QCCN | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.9 mm | 3.3 mm | 3.3 mm | 3.05 mm | 5.9 mm | 3.05 mm | 3.56 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD |
| 厂商名称 | Xicor Inc | Xicor Inc | Xicor Inc | - | - | Xicor Inc | Xicor Inc |
| JESD-609代码 | e0 | e4 | - | e0 | e0 | e0 | - |
| 端子面层 | TIN LEAD | GOLD | - | TIN LEAD | TIN LEAD | TIN LEAD | - |
| 宽度 | 15.24 mm | - | - | 11.425 mm | 15.24 mm | 11.425 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 包装说明 | - | CERAMIC, FP-28 | CERAMIC, FP-28 | - | - | CERAMIC, LCC-32 | PLASTIC, LCC-32 |
