IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20, FF/Latch
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
器件标准:
下载文档型号 | 74HCT273BQ | 5962-01-269-2702 | 74HC273DB-T | 74HC273BQ |
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描述 | IC HCT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20, FF/Latch | IC IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,PLASTIC, FF/Latch | 触发器 octal D-type | IC HC/UH SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20, FF/Latch |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
包装说明 | HVQCCN, LCC20/24,.14X.18,20 | DIP, DIP20,.3 | SSOP, | HVQCCN, LCC20/24,.14X.18,20 |
Reach Compliance Code | compliant | compli | unknow | compliant |
JESD-30 代码 | R-PQCC-N20 | R-PDIP-T20 | R-PDSO-G20 | R-PQCC-N20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
功能数量 | 1 | 8 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | DIP | SSOP | HVQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | THROUGH-HOLE | GULL WING | NO LEAD |
端子节距 | 0.5 mm | 2.54 mm | 0.65 mm | 0.5 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | QFN | - | SSOP | QFN |
针数 | 20 | - | 20 | 20 |
系列 | HCT | - | HC/UH | HC/UH |
JESD-609代码 | e4 | - | e4 | e4 |
长度 | 4.5 mm | - | 7.2 mm | 4.5 mm |
最大I(ol) | 0.004 A | 0.004 A | - | 0.004 A |
湿度敏感等级 | 1 | - | 1 | 1 |
位数 | 8 | - | 8 | 8 |
输出极性 | TRUE | - | TRUE | TRUE |
封装等效代码 | LCC20/24,.14X.18,20 | DIP20,.3 | - | LCC20/24,.14X.18,20 |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 |
电源 | 5 V | 5 V | - | 2/6 V |
传播延迟(tpd) | 45 ns | - | 225 ns | 225 ns |
座面最大高度 | 1 mm | - | 2 mm | 1 mm |
最大供电电压 (Vsup) | 5.5 V | - | 6 V | 6 V |
最小供电电压 (Vsup) | 4.5 V | - | 2 V | 2 V |
端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 |
宽度 | 2.5 mm | - | 5.3 mm | 2.5 mm |
最小 fmax | 20 MHz | - | 24 MHz | 24 MHz |