A14562-01,A14562-01 pdf中文资料,A14562-01引脚图,A14562-01电路-Datasheet-电子工程世界

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Tflex

500 Series

Innovative

Technology

for a

Connected

World

Thermal Gap Filler

CoMplianT 2.8 W/mK TherMally ConduCTive Gap Filler

Tflex

™

500 is a compliant elastomer gap filler designed to provide excellent thermal

performance while remaining cost effective. This soft interface pad conforms well with

minimal pressure, resulting in little or no stress on mating parts. Tflex

™

500’s unique

silicone and filler combination has extremely low silicone extractables compared to many

other silicone interface products. Tflex

™

500 meets NASA outgassing specification.

Tflex

™

500 is naturally tacky, no adhesive coating is required. Tflex

™

500 is electrically

insulating, stable from -50ºC to 200ºC and is certified to UL 94V0 flammability rating.

FeaTureS and BeneFiTS

•

Thermal conductivity 2.8 W/mK

Highly compliant and cost effective

Low thermal resistance even at low pressure

Available in thicknesses from 0.020-inch (0.25mm) through

0.200-inch (5.0mm) in 0.010-inch increments

• Naturally tacky for easy assembly

• Low silicone extractables

appliCaTionS

•

Cooling components to chassis

Telecommunication hardware

Thermal module for notebook computer

LED solid state lighting

Power electronics

Computer servers

Graphics cards

Gaming systems

LCD and PDP flat panel displays

Industrial automation equipment

Wireless infrastructure

Fragile ASIC components

Automotive engine control

IT devices

Military electronics

global

solutions:

local

support

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

Tflex

500 Series

Thermal Gap Filler

Innovative

Technology

for a

Connected

World

Tflex

500 TypiCal properTieS

Thermal Gap Filler

Preliminary

Tflex

500

Preliminary

TEST METHOD

Thermal Resistance (°C-in2/W)

Tflex 500 Thermal Resistance verse Pressure

2.0

5200

1.5

5160

5120

5100

1.0

580

560

0.5

540

520

Construction

Color

Thermal Conductivity

Hardness (Shore 00)

Density

Standard Thickness

Range

Thickness Tolerance

UL Flammability Rating

Temperature Range

Volume Resistivity

Outgassing TML

Outgassing CVCM

Coefficient Thermal

Expansion (CTE)

Filled silicone

elastomer

Light Blue

2.8 W/mK

(at 3 second delay)

3.0 g/cc

0.020" - 0.200"

(0.5 - 5.1mm)

±10%

94 V0

-50ºC to 200ºC

13 ohm-cm

0.29%

0.04%

37.4 ppm/ºC

70ºC-130ºC

Visual

ASTM D5470

ASTM D2240

Helium

Pycnometer

0.0

Pressure (psi, 1 psi = 6.9 KPa)

Tflex 500 Defection verse Pressure (ASTM D575)

80%

70%

60%

% Deflection

5200

5160

5120

5100

580

560

540

520

ASTM D257

ASTM E595

IPC-TM-650

2.4.24

50%

40%

30%

20%

10%

100

110

Pressure (psi, 1 psi = 6.9 KPa)

STandard ThiCKneSSeS

0.020 to 0.200-inch (0.25 to 5.0mm).

0.020 to 0.030-inch (0.5 to 0.76mm) thick material come standard with fiberglass reinforcement.

0.020 through 0.200 thick material available in 0.010-inch (0.25mm) increments.

opTionS

Proprietary DC1 option available to eliminate tack from top side to aid in handling.

MaTerial naMe and ThiCKneSS

Tflex

™

indicates Laird Technologies’ brand thermally conductive elastomeric gap filler

product. 5xxx indicates ‘500 series’ 2.8 W/mK material, and xxx indicates thickness in -mil

(0.001-inches); -DC1 designates proprietary tack eliminating option

Examples:

Tflex

™

5120 = 0.120-inch thick material

Tflex

™

5120-DC1 = 0.0120-inch thick material with proprietary DC1 option

THR-DS-Tflex-500 0110

Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies

materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,

merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or

consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to

time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird Technologies’ domestic terms and

conditions of sale in effect from time to time, a copy of which will be furnished upon request.

Document A15958-00 Rev B, 11/2009.

型号	A14562-01	A14950-09	A14573-01	A14568-01	A14572-01	A14950-02	A14560-01
描述	Interface Development Tools Development Module for FT232H	Thermal Interface Products Tflex 590 DC1 9x9" 2.8W/mK gap filler	Thermal Interface Products Tflex 5190 9x9" 2.8W/mK gap filler	Schottky Diodes u0026 Rectifiers	Thermal Interface Products Tflex 5180 9x9" 2.8W/mK gap filler	Thermal Interface Products Tflex 620 DC1 9x9" 3.0W/mK gap filler	Thermal Interface Products Tflex 660 DC1 9x9" 3.0W/mK gap filler
产品种类 Product Category	Thermal Interface Products	Thermal Interface Products	Thermal Interface Products	Thermal Interface Products	Thermal Interface Products	Thermal Interface Products	Thermal Interface Products
制造商 Manufacturer	LSR	LSR	LSR	LSR	LSR	LSR	LSR
RoHS	Details	Details	Details	Details	Details	Details	Details
类型 Type	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad	Thermally Conductive Gap Pad
工厂包装数量 Factory Pack Quantity	1	1	1	1	1	1	1
系列 Packaging	Bulk	-	-	Bulk	-	Bulk	Bulk

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