型号
- 型号
- 关键词
IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, PDSO16, MO-153AB, TSSOP-16, PLL or Frequency Synthesis Circuit
厂商名称：ADI(亚德诺半导体)
下载文档| 型号 | ADF4113BRU-REEL | ADF4112BCP-REEL | ADF4112BCP-REEL7 | ADF4113BCP-REEL7 | ADF4113BCP-REEL |
|---|---|---|---|---|---|
| 描述 | IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, PDSO16, MO-153AB, TSSOP-16, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 3000 MHz, CQCC20, MO-220-VGGD, LFCSP-20, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 3000 MHz, CQCC20, MO-220-VGGD, LFCSP-20, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, CQCC20, MO-220-VGGD, LFCSP-20, PLL or Frequency Synthesis Circuit | IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, CQCC20, MO-220-VGGD, LFCSP-20, PLL or Frequency Synthesis Circuit |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP | QFN | QFN | QFN | QFN |
| 包装说明 | MO-153AB, TSSOP-16 | MO-220-VGGD, LFCSP-20 | MO-220-VGGD, LFCSP-20 | MO-220-VGGD, LFCSP-20 | MO-220-VGGD, LFCSP-20 |
| 针数 | 16 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown |
| 其他特性 | 6-BIT SWALLOW COUNTER | 6-BIT SWALLOW COUNTER | 6-BIT SWALLOW COUNTER | 6-BIT SWALLOW COUNTER | 6-BIT SWALLOW COUNTER |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | R-PDSO-G16 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 5 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 1 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | TSSOP | VQCCN | VQCCN | VQCCN | VQCCN |
| 封装等效代码 | TSSOP16,.25 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | LCC20,.16SQ,20 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电流 (Isup) | 11 mA | 7.5 mA | 7.5 mA | 11 mA | 11 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 4.4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| ECCN代码 | 5A991.B | 5A991.B | 5A991.B | 5A991.B | - |