型号
- 型号
- 关键词
Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
厂商名称：SPANSION
厂商官网：http://www.spansion.com/
器件标准：
| 型号 | AM75DL9608HGT75FS | AM75DL9608HGT75FT | AM75DL9608HGB75FT | AM75DL9608HGT70FT | AM75DL9608HGB75FS | AM75DL9608HGT70FS | AM75DL9608HGB70FS | AM75DL9608HGB70FT |
|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 | Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
| 针数 | 73 | 73 | 73 | 73 | 73 | 73 | 73 | 73 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH | PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH |
| JESD-30 代码 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 73 | 73 | 73 | 73 | 73 | 73 | 73 | 73 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |