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BC109CSM-QR-BG4

100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3

器件类别:分立半导体    晶体管   

厂商名称:SEMELAB

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
SEMELAB
零件包装代码
DLCC
包装说明
SMALL OUTLINE, R-CDSO-N3
针数
3
Reach Compliance Code
compliant
ECCN代码
EAR99
最大集电极电流 (IC)
0.1 A
集电极-发射极最大电压
20 V
配置
SINGLE
最小直流电流增益 (hFE)
200
JESD-30 代码
R-CDSO-N3
JESD-609代码
e4
元件数量
1
端子数量
3
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
NPN
认证状态
Not Qualified
表面贴装
YES
端子面层
GOLD
端子形式
NO LEAD
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管元件材料
SILICON
标称过渡频率 (fT)
150 MHz
文档预览
BC109CSM
Dimensions in mm (inches).
0.51 ± 0.10
(0.02 ± 0.004)
0.31 rad.
(0.012)
2.54 ± 0.13
(0.10 ± 0.005)
3
2
1
1.91 ± 0.10
(0.075 ± 0.004)
3.05 ± 0.13
(0.12 ± 0.005)
A=
0.76 ± 0.15
(0.03 ± 0.006)
Bipolar NPN Device in a
Hermetically sealed LCC1
Ceramic Surface Mount
Package for High
Reliability Applications
0.31 rad.
(0.012)
A
1.40
(0.055)
max.
Bipolar NPN Device.
V
CEO
= 20V
I
C
= 0.1A
1.02 ± 0.10
(0.04 ± 0.004)
PINOUTS
1 – Base
2 – Emitter
3 - Collector
All Semelab hermetically sealed products
can be processed in accordance with the
requirements of BS, CECC and JAN,
JANTX, JANTXV and JANS specifications
Parameter
V
CEO
*
I
C(CONT)
h
FE
f
t
P
D
Test Conditions
Min.
Typ.
Max.
20
0.1
Units
V
A
-
Hz
@ 5/2m (V
CE
/ I
C
)
200
150M
800
0.3
W
* Maximum Working Voltage
This is a shortform datasheet. For a full datasheet please contact
sales@semelab.co.uk.
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Generated
2-Aug-02
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参数对比
与BC109CSM-QR-BG4相近的元器件有:BC109CSM-JQR-BG4、BC109CSM-JQR-AG4、BC109CSM-JQRG4、BC109CSM.MODG4。描述及对比如下:
型号 BC109CSM-QR-BG4 BC109CSM-JQR-BG4 BC109CSM-JQR-AG4 BC109CSM-JQRG4 BC109CSM.MODG4
描述 100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3 100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3 100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3 100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3 100mA, 20V, NPN, Si, SMALL SIGNAL TRANSISTOR, HERMETIC SEALED, CERAMIC, LCC1-3
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合
厂商名称 SEMELAB SEMELAB SEMELAB SEMELAB SEMELAB
零件包装代码 DLCC DLCC DLCC DLCC DLCC
包装说明 SMALL OUTLINE, R-CDSO-N3 SMALL OUTLINE, R-CDSO-N3 SMALL OUTLINE, R-CDSO-N3 SMALL OUTLINE, R-CDSO-N3 SMALL OUTLINE, R-CDSO-N3
针数 3 3 3 3 3
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
最大集电极电流 (IC) 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A
集电极-发射极最大电压 20 V 20 V 20 V 20 V 20 V
配置 SINGLE SINGLE SINGLE SINGLE SINGLE
最小直流电流增益 (hFE) 200 200 200 200 200
JESD-30 代码 R-CDSO-N3 R-CDSO-N3 R-CDSO-N3 R-CDSO-N3 R-CDSO-N3
JESD-609代码 e4 e4 e4 e4 e4
元件数量 1 1 1 1 1
端子数量 3 3 3 3 3
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
极性/信道类型 NPN NPN NPN NPN NPN
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES
端子面层 GOLD GOLD GOLD GOLD GOLD
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON
标称过渡频率 (fT) 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz
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