TRANSISTOR UHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, MOSFET, CERAMIC PACKAGE-4, FET RF Small Signal
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
器件标准:
下载文档型号 | BLF521 | BLF246B | BLF542 | BLF404 |
---|---|---|---|---|
描述 | TRANSISTOR UHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, MOSFET, CERAMIC PACKAGE-4, FET RF Small Signal | TRANSISTOR 2 CHANNEL, VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, FET RF Power | TRANSISTOR UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, SOT-171A, 6 PIN, FET RF Power | TRANSISTOR UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC, SMD, 8 PIN, FET RF Power |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
包装说明 | CERAMIC PACKAGE-4 | FLANGE MOUNT, R-CDFM-F8 | FLANGE MOUNT, R-CDFM-F6 | SMALL OUTLINE, R-CDSO-G8 |
Reach Compliance Code | unknown | compliant | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
配置 | SINGLE | COMMON SOURCE, 2 ELEMENTS | SINGLE | SINGLE |
最小漏源击穿电压 | 40 V | 65 V | 65 V | 40 V |
最大漏极电流 (Abs) (ID) | 1 A | 8 A | 1.5 A | 1.5 A |
最大漏极电流 (ID) | 1 A | 8 A | 1.5 A | 1.5 A |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
最高频带 | ULTRA HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | ULTRA HIGH FREQUENCY BAND | ULTRA HIGH FREQUENCY BAND |
JESD-30 代码 | O-CRDB-F4 | R-CDFM-F8 | R-CDFM-F6 | R-CDSO-G8 |
元件数量 | 1 | 2 | 1 | 1 |
端子数量 | 4 | 8 | 6 | 8 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 200 °C | 200 °C | 200 °C | 200 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | DISK BUTTON | FLANGE MOUNT | FLANGE MOUNT | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES |
端子形式 | FLAT | FLAT | FLAT | GULL WING |
端子位置 | RADIAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
晶体管应用 | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
针数 | 4 | - | 6 | 8 |
外壳连接 | SOURCE | ISOLATED | ISOLATED | - |
功耗环境最大值 | 10 W | 130 W | 20 W | - |
最大功率耗散 (Abs) | 10 W | 130 W | - | 8.3 W |
最小功率增益 (Gp) | 10 dB | 14 dB | 13 dB | - |
厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |