8KX8 EEPROM 5V, 120ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28
厂商官网:https://www.rocelec.com/
下载文档型号 | CAT28C64BH1312 | CAT28C64BLI15 | CAT28C64BH13I12 | CAT28C64BH13-12 | CAT28C64BH1390 | CAT28C64BH13-90 |
---|---|---|---|---|---|---|
描述 | 8KX8 EEPROM 5V, 120ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | 8KX8 EEPROM 5V, 150ns, PDIP28, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-28 | 8KX8 EEPROM 5V, 120ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | 8KX8 EEPROM 5V, 90ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | TSOP | DIP | TSOP | TSOP | TSOP | TSOP |
包装说明 | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | DIP, | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | TSOP1, | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | TSOP1, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 120 ns | 150 ns | 120 ns | 120 ns | 90 ns | 90 ns |
JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
长度 | 11.8 mm | 36.695 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | DIP | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | Not Qualified | COMMERCIAL | Not Qualified |
座面最大高度 | 1.2 mm | 6.35 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.55 mm | 2.54 mm | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 8 mm | 15.24 mm | 8 mm | 8 mm | 8 mm | 8 mm |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | - |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | - |