型号
- 型号
- 关键词
| 型号 | CD4015BMJ/883B | CD4015BMJ/883C | CD4015BMJ | CD4015BCJ | CD4015BMW/883 | CD4015BMW/883C | CD4015BMW/883B | CD4015BCN | CD4015BCN/B+ |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC | 4000/14000/40000 SERIES, 4-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | 4000/14000/40000 SERIES, 4-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | IC,SHIFT REGISTER,CMOS,FP,16PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,FP,16PIN,CERAMIC | IC,SHIFT REGISTER,CMOS,FP,16PIN,CERAMIC | 4000/14000/40000 SERIES, 4-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 | IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-XDFP-F16 | R-XDFP-F16 | R-XDFP-F16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DFP | DFP | DFP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 3/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 3/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 计数方向 | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | - |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class C | - | - | 38535Q/M;38534H;883B | MIL-STD-883 Class C | 38535Q/M;38534H;883B | - | - |