型号
- 型号
- 关键词
| 型号 | CD4067BE | CD4067BH | CD4097BE | CD4097BF | CD4067BF | CD4097BD | CD4067BD | CD4097BH |
|---|---|---|---|---|---|---|---|---|
| 描述 | CD4067BE | 16-CHANNEL, SGL ENDED MULTIPLEXER, UUC24 | CD4097BE | CD4097BF | CD4067BF | CD4097BD | CD4067BD | CD4097BH |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | - | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | DIP | DIP | - |
| 包装说明 | PLASTIC, DIP-24 | DIE, | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | - |
| 针数 | 24 | - | 24 | 24 | 24 | 24 | 24 | - |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - |
| JESD-30 代码 | R-PDIP-T24 | X-XUUC-N24 | R-PDIP-T24 | R-CDIP-T24 | - | R-CDIP-T24 | R-CDIP-T24 | - |
| JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 | - |
| 信道数量 | 16 | 16 | 8 | 8 | - | 8 | 16 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | 24 | 24 | 24 | 24 | - | 24 | 24 | - |
| 通态电阻匹配规范 | 5 Ω | 5 Ω | 5 Ω | 5 Ω | - | 5 Ω | 5 Ω | - |
| 最大通态电阻 (Ron) | 240 Ω | 320 Ω | 320 Ω | 320 Ω | - | 320 Ω | 320 Ω | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
| 封装代码 | DIP | DIE | DIP | DIP | - | DIP | DIP | - |
| 封装等效代码 | DIP24,.6 | - | DIP24,.6 | DIP24,.6 | - | DIP24,.6 | DIP24,.6 | - |
| 封装形状 | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5/15 V | - | 5/15 V | 5/15 V | - | 5/15 V | 5/15 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 6.35 mm | - | 6.35 mm | 5.72 mm | - | 5.72 mm | 5.72 mm | - |
| 最大信号电流 | 0.025 A | - | 0.025 A | 0.025 A | - | 0.025 A | 0.01 A | - |
| 最大供电电流 (Isup) | 3 mA | - | 3 mA | 3 mA | - | 3 mA | 0.6 mA | - |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | - | 18 V | 18 V | - |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | - |
| 表面贴装 | NO | YES | NO | NO | - | NO | NO | - |
| 最长断开时间 | 440 ns | 440 ns | 440 ns | 440 ns | - | 440 ns | 440 ns | - |
| 最长接通时间 | 650 ns | 650 ns | 650 ns | 650 ns | - | 650 ns | 650 ns | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | UPPER | DUAL | DUAL | - | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 15.24 mm | - | 15.24 mm | 15.24 mm | - | 15.24 mm | 15.24 mm | - |
