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CD4502B

CD4502B CMOS Strobed Hex Inverter/Buffer with 3-State Outputs

器件类别:半导体    逻辑   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

器件标准:

敬请期待
器件参数
参数名称
属性值
tpd @ nom Voltage(Max)(ns)
380
VCC(Max)(V)
18
F @ nom voltage(Max)(Mhz)
12
Rating
Catalog
IOL(Max)(mA)
6
VCC(Min)(V)
3
Voltage(Nom)(V)
5
Package Group
PDIP|16,SOIC|16,SO|16,TSSOP|16
Operating temperature range(C)
-55 to 125
Bits(#)
6
IOH(Max)(mA)
-1
Schmitt trigger
No
Technology Family
CD4000
Approx. price(US$)
0.12 | 1ku
ICC @ nom voltage(Max)(mA)
0.03
参数对比
与CD4502B相近的元器件有:7702002EA、CD4502BF3A、JM38510/17403BEA、M38510/17403BEA、CD4502B-MIL。描述及对比如下:
型号 CD4502B 7702002EA CD4502BF3A JM38510/17403BEA M38510/17403BEA CD4502B-MIL
描述 CD4502B CMOS Strobed Hex Inverter/Buffer with 3-State Outputs CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 CD4502B-MIL CMOS Strobed Hex Inverter/Buffer with 3-State Outputs
Brand Name - Texas Instruments Texas Instruments Texas Instruments Texas Instruments -
厂商名称 - Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) -
零件包装代码 - DIP DIP DIP DIP -
包装说明 - DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP, DIP16,.3 -
针数 - 16 16 16 16 -
Reach Compliance Code - not_compliant not_compliant not_compliant not_compliant -
Factory Lead Time - 6 weeks 6 weeks 6 weeks 6 weeks -
计数方向 - UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL -
系列 - 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 -
JESD-30 代码 - R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 -
JESD-609代码 - e0 e0 e0 e0 -
长度 - 19.56 mm 19.05 mm 19.17 mm 19.56 mm -
负载电容(CL) - 50 pF 50 pF 50 pF 50 pF -
逻辑集成电路类型 - BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER -
最大I(ol) - 0.006 A 0.006 A 0.006 A 0.006 A -
位数 - 6 6 6 6 -
功能数量 - 1 1 1 1 -
端口数量 - 2 2 2 2 -
端子数量 - 16 16 16 16 -
最高工作温度 - 125 °C 125 °C 125 °C 125 °C -
最低工作温度 - -55 °C -55 °C -55 °C -55 °C -
输出特性 - 3-STATE 3-STATE 3-STATE 3-STATE -
输出极性 - INVERTED INVERTED INVERTED INVERTED -
封装主体材料 - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED -
封装代码 - DIP DIP DIP DIP -
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 - IN-LINE IN-LINE IN-LINE IN-LINE -
包装方法 - TUBE TUBE TUBE TUBE -
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
最大电源电流(ICC) - 0.03 mA 0.03 mA 0.03 mA 0.03 mA -
Prop。Delay @ Nom-Sup - 570 ns 380 ns 380 ns 535 ns -
传播延迟(tpd) - 380 ns 380 ns 380 ns 535 ns -
认证状态 - Qualified Not Qualified Not Qualified Qualified -
筛选级别 - MIL-STD-883 38535Q/M;38534H;883B MIL-M-38510 Class B MIL-PRF-38535 Class B -
座面最大高度 - 5.08 mm 5.08 mm 5.33 mm 5.08 mm -
最大供电电压 (Vsup) - 18 V 18 V 18 V 5.5 V -
最小供电电压 (Vsup) - 3 V 3 V 3 V 4.5 V -
标称供电电压 (Vsup) - 5 V 5 V 5 V 5 V -
表面贴装 - NO NO NO NO -
技术 - CMOS CMOS CMOS CMOS -
温度等级 - MILITARY MILITARY MILITARY MILITARY -
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子形式 - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE -
端子节距 - 2.54 mm 2.54 mm 2.54 mm 2.54 mm -
端子位置 - DUAL DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
翻译 - N/A N/A N/A N/A -
宽度 - 7.62 mm 7.62 mm 7.62 mm 6.92 mm -
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