型号
- 型号
- 关键词
| 型号 | CD4502B-MIL | 7702002EA | CD4502BF3A | JM38510/17403BEA | M38510/17403BEA | CD4502B |
|---|---|---|---|---|---|---|
| 描述 | CD4502B-MIL CMOS Strobed Hex Inverter/Buffer with 3-State Outputs | CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 | CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 | CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 | CMOS Strobed Hex Inverter/Buffer with 3-State Outputs 16-CDIP -55 to 125 | CD4502B CMOS Strobed Hex Inverter/Buffer with 3-State Outputs |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | DIP | DIP | DIP | DIP | - |
| 包装说明 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, | DIP, DIP16,.3 | - |
| 针数 | - | 16 | 16 | 16 | 16 | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | - |
| Factory Lead Time | - | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - |
| 计数方向 | - | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | - |
| JESD-30 代码 | - | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - |
| 长度 | - | 19.56 mm | 19.05 mm | 19.17 mm | 19.56 mm | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | - |
| 位数 | - | 6 | 6 | 6 | 6 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | - |
| 端口数量 | - | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | - | INVERTED | INVERTED | INVERTED | INVERTED | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | - | DIP | DIP | DIP | DIP | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
| 包装方法 | - | TUBE | TUBE | TUBE | TUBE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 最大电源电流（ICC） | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | - |
| Prop。Delay @ Nom-Sup | - | 570 ns | 380 ns | 380 ns | 535 ns | - |
| 传播延迟（tpd） | - | 380 ns | 380 ns | 380 ns | 535 ns | - |
| 认证状态 | - | Qualified | Not Qualified | Not Qualified | Qualified | - |
| 筛选级别 | - | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-M-38510 Class B | MIL-PRF-38535 Class B | - |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.33 mm | 5.08 mm | - |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | 18 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 4.5 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | NO | NO | NO | NO | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 翻译 | - | N/A | N/A | N/A | N/A | - |
| 宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm | 6.92 mm | - |
瑞萨电子MCU
嵌入式系统
RF/无线
微控制器 MCU
国产芯片交流
微控制器 MCU