型号
- 型号
- 关键词
| 型号 | COP8SDE9HLQ9 | COP8SDE9IMT9/NOPB | COP8SCE9IMT9 | COP8SBE9IMT9 | COP8SBE9HLQ9 | COP8SCE9HLQ9 |
|---|---|---|---|---|---|---|
| 描述 | IC MCU 8BIT 8KB FLASH 44WQFN | IC MCU 8BIT 8KB FLASH 48TSSOP | IC MCU 8BIT 8KB FLASH 48TSSOP | IC MCU 8BIT 8KB FLASH 48TSSOP | IC MCU 8BIT 8KB FLASH 44WQFN | IC MCU 8BIT 8KB FLASH 44WQFN |
| 速度 | 20 MHz | 20MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | VQCCN, LCC44,.28SQ,20 | - | TSSOP, | TSSOP, TSSOP48,.3,20 | QCCN, LCC44,.28SQ,20 | HVBCC, |
| Reach Compliance Code | unknown | - | unknown | unknown | compliant | unknown |
| 位大小 | 8 | - | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-XQCC-N44 | - | R-PDSO-G48 | R-PDSO-G48 | S-XQCC-N44 | S-XBCC-B44 |
| 端子数量 | 44 | - | 48 | 48 | 44 | 44 |
| 最高工作温度 | 125 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | UNSPECIFIED |
| 封装代码 | VQCCN | - | TSSOP | TSSOP | QCCN | HVBCC |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM（字节） | 256 | - | 256 | 256 | 256 | 256 |
| ROM（单词） | 8192 | - | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | FLASH | - | FLASH | FLASH | FLASH | FLASH |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | NO LEAD | BUTT |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | QUAD | BOTTOM |