Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PQFP64
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:SONY(索尼)
厂商官网:http://www.sony.co.jp
下载文档型号 | CXP5014H-Q | CXP5014Q | CXP5014H-S | CXP5014S | CXP5016Q | CXP5016H-S | CXP5016H-Q | CXP5016S |
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描述 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PDIP64 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFP | QFP | DIP | DIP | QFP | DIP | QFP | DIP |
包装说明 | QFP, QFP64,.7X.95,40 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 |
针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
位大小 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
CPU系列 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 |
JESD-30 代码 | R-PQFP-G64 | R-PQFP-G64 | R-PDIP-T64 | R-PDIP-T64 | R-PQFP-G64 | R-PDIP-T64 | R-PQFP-G64 | R-PDIP-T64 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | SDIP | SDIP | QFP | SDIP | QFP | SDIP |
封装等效代码 | QFP64,.7X.95,40 | QFP64,.7X.95,40 | SDIP64,.75 | SDIP64,.75 | QFP64,.7X.95,40 | SDIP64,.75 | QFP64,.7X.95,40 | SDIP64,.75 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
ROM(单词) | 4096 | 4096 | 4096 | 4096 | 6144 | 6144 | 6144 | 6144 |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
速度 | 0.62 MHz | 0.31 MHz | 0.62 MHz | 0.31 MHz | 0.31 MHz | 0.62 MHz | 0.62 MHz | 0.31 MHz |
最大压摆率 | 20 mA | 15 mA | 20 mA | 15 mA | 15 mA | 20 mA | 20 mA | 15 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1 mm | 1 mm | 1.78 mm | 1.78 mm | 1 mm | 1.78 mm | 1 mm | 1.78 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |