型号
- 型号
- 关键词
Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PDIP64
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：SONY(索尼)
厂商官网：http://www.sony.co.jp
下载文档| 型号 | CXP5014H-S | CXP5014H-Q | CXP5014Q | CXP5014S | CXP5016Q | CXP5016H-S | CXP5016H-Q | CXP5016S |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.62MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, SPC500 CPU, 0.31MHz, CMOS, PDIP64 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QFP | QFP | DIP | QFP | DIP | QFP | DIP |
| 包装说明 | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 | SDIP, SDIP64,.75 |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| CPU系列 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 | SPC500 |
| JESD-30 代码 | R-PDIP-T64 | R-PQFP-G64 | R-PQFP-G64 | R-PDIP-T64 | R-PQFP-G64 | R-PDIP-T64 | R-PQFP-G64 | R-PDIP-T64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | QFP | QFP | SDIP | QFP | SDIP | QFP | SDIP |
| 封装等效代码 | SDIP64,.75 | QFP64,.7X.95,40 | QFP64,.7X.95,40 | SDIP64,.75 | QFP64,.7X.95,40 | SDIP64,.75 | QFP64,.7X.95,40 | SDIP64,.75 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 6144 | 6144 | 6144 | 6144 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 0.62 MHz | 0.62 MHz | 0.31 MHz | 0.31 MHz | 0.31 MHz | 0.62 MHz | 0.62 MHz | 0.31 MHz |
| 最大压摆率 | 20 mA | 20 mA | 15 mA | 15 mA | 15 mA | 20 mA | 20 mA | 15 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.78 mm | 1 mm | 1 mm | 1.78 mm | 1 mm | 1.78 mm | 1 mm | 1.78 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
