型号 | CY93422LC | CY93422LMB | CY93L422LMB | CY93422ALMB | CY93L422LC | CY93L422ALC | CY93422ALC |
---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 256X4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 60ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 75ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 60ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256X4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
零件包装代码 | QLCC | QLCC | QLCC | QLCC | QLCC | QLCC | QLCC |
包装说明 | CERAMIC, LCC-28 | CERAMIC, LCC-28 | CERAMIC, LCC-28 | CERAMIC, LCC-28 | CERAMIC, LCC-28 | CERAMIC, LCC-28 | CERAMIC, LCC-28 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 |
最长访问时间 | 45 ns | - | 75 ns | 45 ns | - | 45 ns | 35 ns |
JESD-30 代码 | R-CQCC-N28 | - | R-CQCC-N28 | R-CQCC-N28 | - | R-CQCC-N28 | R-CQCC-N28 |
JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 |
长度 | 13.97 mm | - | 13.97 mm | 13.97 mm | - | 13.97 mm | 13.97 mm |
内存密度 | 1024 bit | - | 1024 bit | 1024 bit | - | 1024 bit | 1024 bit |
内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | - | 4 | 4 | - | 4 | 4 |
功能数量 | 1 | - | 1 | 1 | - | 1 | 1 |
端口数量 | 1 | - | 1 | 1 | - | 1 | 1 |
端子数量 | 28 | - | 28 | 28 | - | 28 | 28 |
字数 | 256 words | - | 256 words | 256 words | - | 256 words | 256 words |
字数代码 | 256 | - | 256 | 256 | - | 256 | 256 |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 75 °C | - | 125 °C | 125 °C | - | 75 °C | 75 °C |
组织 | 256X4 | - | 256X4 | 256X4 | - | 256X4 | 256X4 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
可输出 | YES | - | YES | YES | - | YES | YES |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN | - | QCCN | QCCN | - | QCCN | QCCN |
封装等效代码 | LCC28,.35X.55 | - | LCC28,.35X.55 | LCC28,.35X.55 | - | LCC28,.35X.55 | LCC28,.35X.55 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 240 | - | 240 | 240 | - | 240 | 240 |
电源 | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | - | 1.905 mm | 1.905 mm | - | 1.905 mm | 1.905 mm |
最大待机电流 | 0.12 A | - | 0.09 A | 0.13 A | - | 0.08 A | 0.12 A |
最小待机电流 | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
最大压摆率 | 0.12 mA | - | 0.09 mA | 0.13 mA | - | 0.08 mA | 0.12 mA |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | - | YES | YES |
技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | - | MILITARY | MILITARY | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
端子位置 | QUAD | - | QUAD | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | - | 30 | 30 |
宽度 | 8.89 mm | - | 8.89 mm | 8.89 mm | - | 8.89 mm | 8.89 mm |