型号 | DPS256X36L-35C | DPS256X36L-45C | DPS256X36L-25C | DPS256X36L-20C | DPS256X36L-30C |
---|---|---|---|---|---|
描述 | SRAM Module, 1MX9, 35ns, CMOS, PZMA68 | SRAM Module, 1MX9, 45ns, CMOS, PZMA68 | SRAM Module, 1MX9, 25ns, CMOS, PZMA68 | SRAM Module, 1MX9, 20ns, CMOS, PZMA68 | SRAM Module, 1MX9, 30ns, CMOS, PZMA68 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Twilight Technology Inc | Twilight Technology Inc | Twilight Technology Inc | Twilight Technology Inc | Twilight Technology Inc |
包装说明 | ZIP, ZIP68,.1,.1 | ZIP, ZIP68,.1,.1 | ZIP, ZIP68,.1,.1 | ZIP, ZIP68,.1,.1 | ZIP, ZIP68,.1,.1 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 35 ns | 45 ns | 25 ns | 20 ns | 30 ns |
其他特性 | USER CONFIGURABLE AS 256K X 36 | USER CONFIGURABLE AS 256K X 36 | USER CONFIGURABLE AS 256K X 36 | USER CONFIGURABLE AS 256K X 36 | USER CONFIGURABLE AS 256K X 36 |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PZMA-T68 | R-PZMA-T68 | R-PZMA-T68 | R-PZMA-T68 | R-PZMA-T68 |
内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 9 | 9 | 9 | 9 | 9 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | ZIP | ZIP | ZIP | ZIP | ZIP |
封装等效代码 | ZIP68,.1,.1 | ZIP68,.1,.1 | ZIP68,.1,.1 | ZIP68,.1,.1 | ZIP68,.1,.1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 1.6 mA | 1.6 mA | 1.6 mA | 1.6 mA | 1.6 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |