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DS1220AB-100IND

NVRAM 16k Nonvolatile SRAM

器件类别:存储    存储   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Maxim(美信半导体)
零件包装代码
DMA
包装说明
0.720 INCH, PLASTIC, DIP-24
针数
24
Reach Compliance Code
not_compliant
ECCN代码
EAR99
最长访问时间
100 ns
JESD-30 代码
R-XDMA-P24
JESD-609代码
e0
内存密度
16384 bit
内存集成电路类型
NON-VOLATILE SRAM MODULE
内存宽度
8
功能数量
1
端子数量
24
字数
2048 words
字数代码
2000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
2KX8
封装主体材料
UNSPECIFIED
封装代码
DIP
封装等效代码
DIP24,.6
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
最大待机电流
0.005 A
最大压摆率
0.085 mA
最大供电电压 (Vsup)
5.25 V
最小供电电压 (Vsup)
4.75 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
PIN/PEG
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
19-5580; Rev 10/10
DS1220AB/AD
16k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Directly replaces 2k x 8 volatile static RAM
or EEPROM
Unlimited write cycles
Low-power CMOS
JEDEC standard 24-pin DIP package
Read and write access times of 100 ns
Lithium energy source is electrically
disconnected to retain freshness until power
is applied for the first time
Full ±10% V
CC
operating range (DS1220AD)
Optional ±5% V
CC
operating range
(DS1220AB)
Optional industrial temperature range of
-40°C to +85°C, designated IND
PIN ASSIGNMENT
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
A8
A9
WE
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
24-Pin ENCAPSULATED PACKAGE
720-mil EXTENDED
PIN DESCRIPTION
A0-A10
DQ0-DQ7
CE
WE
OE
V
CC
GND
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+5V)
- Ground
DESCRIPTION
The DS1220AB and DS1220AD 16k Nonvolatile SRAMs are 16,384-bit, fully static, nonvolatile SRAMs
organized as 2048 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and
control circuitry which constantly monitors V
CC
for an out-of-tolerance condition. When such a condition
occurs, the lithium energy source is automatically switched on and write protection is unconditionally
enabled to prevent data corruption. The NV SRAMs can be used in place of existing 2k x 8 SRAMs
directly conforming to the popular bytewide 24-pin DIP standard. The devices also match the pinout of
the 2716 EPROM and the 2816 EEPROM, allowing direct substitution while enhancing performance.
There is no limit on the number of write cycles that can be executed and no additional support circuitry is
required for microprocessor interfacing.
1 of 8
DS1220AB/AD
READ MODE
The DS1220AB and DS1220AD execute a read cycle whenever
WE
(Write Enable) is inactive (high) and
CE (Chip Enable) and OE (Output Enable) are active (low). The unique address specified by the 11
address inputs (A0-A10) defines which of the 2048 bytes of data is to be accessed. Valid data will be
available to the eight data output drivers within t
ACC
(Access Time) after the last address input signal is
stable, providing that the
CE
and
OE
access times are also satisfied. If
CE
and
OE
access times are not
satisfied, then data access must be measured from the later-occurring signal and the limiting parameter is
either t
CO
for
CE
or t
OE
for
OE
rather than address access.
WRITE MODE
The DS1220AB and DS1220AD execute a write cycle whenever the
WE
and
CE
signals are active (low)
after address inputs are stable. The latter occurring falling edge of
CE
or
WE
will determine the start of
the write cycle. The write cycle is terminated by the earlier rising edge of
CE
or
WE
. All address inputs
must be kept valid throughout the write cycle.
WE
must return to the high state for a minimum recovery
time (t
WR
) before another cycle can be initiated. The OE control signal should be kept inactive (high)
during write cycles to avoid bus contention. However, if the output drivers are enabled (
CE
and
OE
active) then
WE
will disable the outputs in t
ODW
from its falling edge.
DATA RETENTION MODE
The DS1220AB provides full functional capability for V
CC
greater than 4.75 volts and write protects by
4.5V. The DS1220AD provides full functional capability for V
CC
greater than 4.5 volts and write protects
by 4.25V. Data is maintained in the absence of V
CC
without any additional support circuitry. The
nonvolatile static RAMs constantly monitor V
CC
. Should the supply voltage decay, the NV SRAMs
automatically write protect themselves, all inputs become “don’t care,” and all outputs become high
impedance. As V
CC
falls below approximately 3.0 volts, a power switching circuit connects the lithium
energy source to RAM to retain data. During power-up, when V
CC
rises above approximately 3.0 volts,
the power switching circuit connects external V
CC
to RAM and disconnects the lithium energy source.
Normal RAM operation can resume after V
CC
exceeds 4.75 volts for the DS1220AB and 4.5 volts for the
DS1220AD.
FRESHNESS SEAL
Each DS1220 device is shipped from Dallas Semiconductor with its lithium energy source disconnected,
guaranteeing full energy capacity. When V
CC
is first applied at a level of greater than V
TP
, the lithium
energy source is enabled for battery backup operation.
2 of 8
DS1220AB/AD
ABSOLUTE MAXIMUM RATINGS
Voltage on Any Pin Relative to Ground
Operating Temperature Range
Commercial:
Industrial:
Storage Temperature
Lead Temperature (soldering, 10s)
Note:
EDIP is wave or hand soldered only.
-0.3V to +6.0V
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
+260°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER
DS1220AB Power Supply Voltage
DS1220AD Power Supply Voltage
Logic 1
Logic 0
SYMBOL MIN TYP
V
CC
4.75 5.0
V
CC
4.50 5.0
V
IH
2.2
V
IL
0.0
(T
A
: See Note 10)
MAX UNITS
5.25
V
5.50
V
V
CC
V
+0.8
V
NOTES
DC ELECTRICAL CHARACTERISTICS
(T
A
: See Note 10)
(V
CC
= 5V
±
5% for DS1220AB)
(V
CC
= 5V
±
10% for DS1220AD)
MAX UNITS
+1.0
µA
+1.0
µA
mA
mA
mA
mA
mA
mA
V
V
NOTES
PARAMETER
Input Leakage Current
I/O Leakage Current
CE
V
IH
V
CC
Output Current @ 2.4V
Output Current @ 0.4V
Standby Current
CE
=
2.2V
Standby Current
CE
=
V
CC
-0.5V
Operating Current
(Commercial)
Operating Current
(Industrial)
Write Protection Voltage
(DS1220AB)
Write Protection Voltage
(DS1220AD)
SYMBOL MIN TYP
-1.0
I
IL
-1.0
I
IO
I
OH
I
OL
I
CCS1
I
CCS2
I
CC01
I
CCO1
V
TP
V
TP
4.5
4.25
4.62
4.37
-1.0
2.0
5.0
3.0
10.0
5.0
75
85
4.75
4.5
CAPACITANCE
PARAMETER
Input Capacitance
Input/Output Capacitance
SYMBOL MIN TYP
C
IN
5
C
I/O
5
(T
A
= +25°C)
MAX UNITS
10
pF
12
pF
NOTES
3 of 8
DS1220AB/AD
AC ELECTRICAL CHARACTERISTICS
(T
A
:
See Note 10)
(V
CC
= 5.0V
±
5% for DS1220AB)
(V
CC
= 5.0V
±
10% for DS1220AD)
DS1220AB-100
DS1220AD-100
MIN
MAX
100
100
50
100
5
35
5
100
75
0
0
10
35
5
40
0
10
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
PARAMETER
Read Cycle Time
Access Time
OE to Output Valid
CE
to Output Valid
OE
or
CE
to Output Active
Output High Z from
Deselection
Output Hold from Address Change
Write Cycle Time
Write Pulse Width
Address Setup Time
Write Recovery Time
Output High from
WE
Output Active from
WE
Data Setup Time
Data Hold Time
SYMBOL
t
RC
t
ACC
t
OE
t
CO
t
COE
t
OD
t
OH
t
WC
t
WP
t
AW
t
WR1
t
WR2
t
ODW
t
OEW
t
DS
t
DH1
t
DH2
5
5
3
12
13
5
4
4
12
13
4 of 8
DS1220AB/AD
READ CYCLE
SEE NOTE 1
WRITE CYCLE 1
SEE NOTES 2, 3, 4, 6, 7, 8 AND 12
WRITE CYCLE 2
SEE NOTES 2, 3, 4, 6, 7, 8 AND 13
5 of 8
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参数对比
与DS1220AB-100IND相近的元器件有:DS1220AB-100、DS1220AD-150、DS1220AD-200、DS1220AB-100+。描述及对比如下:
型号 DS1220AB-100IND DS1220AB-100 DS1220AD-150 DS1220AD-200 DS1220AB-100+
描述 NVRAM 16k Nonvolatile SRAM NVRAM NVRAM 16k Nonvolatile SRAM NVRAM 16k Nonvolatile SRAM NVRAM 16k Nonvolatile SRAM
是否Rohs认证 不符合 不符合 不符合 不符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 DMA DIP DIP DIP DMA
包装说明 0.720 INCH, PLASTIC, DIP-24 0.720 INCH, PLASTIC, DIP-24 0.720 INCH, PLASTIC, DIP-24 0.720 INCH, PLASTIC, DIP-24 DIP, DIP24,.6
针数 24 24 24 24 24
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 100 ns 100 ns 150 ns 200 ns 100 ns
JESD-30 代码 R-XDMA-P24 R-XDMA-P24 R-XDMA-P24 R-XDMA-P24 R-PDMA-P24
JESD-609代码 e0 e0 e0 e0 e3
内存密度 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
内存集成电路类型 NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
内存宽度 8 8 8 8 8
功能数量 1 1 1 1 1
端子数量 24 24 24 24 24
字数 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 70 °C 70 °C 70 °C
组织 2KX8 2KX8 2KX8 2KX8 2KX8
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
封装代码 DIP DIP DIP DIP DIP
封装等效代码 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED 240 240 240 NOT SPECIFIED
电源 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.005 A 0.005 A 0.005 A 0.005 A 0.01 A
最大压摆率 0.085 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA
最大供电电压 (Vsup) 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V
最小供电电压 (Vsup) 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) MATTE TIN
端子形式 PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 20 20 NOT SPECIFIED
是否无铅 - 含铅 含铅 含铅 不含铅
长度 - 33.785 mm 33.785 mm 33.785 mm 33.02 mm
湿度敏感等级 - 1 1 1 -
座面最大高度 - 10.54 mm 10.54 mm 10.54 mm 10.668 mm
宽度 - 15.24 mm 15.24 mm 15.24 mm 15.24 mm
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