DDR DRAM, 128MX8, 0.225ns, CMOS, PBGA78,
厂商名称:Micron Technology
厂商官网:http://www.mdtic.com.tw/
器件标准:
下载文档型号 | EDJ1108BDSE-GL-F | EDJ1108BDSE-GN-F | EDJ1108BDSE-AE-F |
---|---|---|---|
描述 | DDR DRAM, 128MX8, 0.225ns, CMOS, PBGA78, | DDR DRAM, 128MX8, 0.225ns, CMOS, PBGA78, | DDR DRAM, 128MX8, 0.3ns, CMOS, PBGA78, |
是否Rohs认证 | 符合 | 符合 | 符合 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology |
包装说明 | FBGA, BGA78,9X13,32 | FBGA, BGA78,9X13,32 | FBGA, BGA78,9X13,32 |
Reach Compliance Code | compliant | compliant | compli |
最长访问时间 | 0.225 ns | 0.225 ns | 0.3 ns |
最大时钟频率 (fCLK) | 800 MHz | 800 MHz | 533 MHz |
I/O 类型 | COMMON | COMMON | COMMON |
交错的突发长度 | 4,8 | 4,8 | 4,8 |
JESD-30 代码 | R-PBGA-B78 | R-PBGA-B78 | R-PBGA-B78 |
内存密度 | 1073741824 bit | 1073741824 bit | 1073741824 bi |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 8 | 8 | 8 |
端子数量 | 78 | 78 | 78 |
字数 | 134217728 words | 134217728 words | 134217728 words |
字数代码 | 128000000 | 128000000 | 128000000 |
组织 | 128MX8 | 128MX8 | 128MX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA |
封装等效代码 | BGA78,9X13,32 | BGA78,9X13,32 | BGA78,9X13,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
电源 | 1.5 V | 1.5 V | 1.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 |
连续突发长度 | 4,8 | 4,8 | 4,8 |
最大压摆率 | 0.35 mA | 0.35 mA | 0.27 mA |
标称供电电压 (Vsup) | 1.5 V | 1.5 V | 1.5 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM |